{"id":2169744,"url":"https://alion.io/job/nexperia-staff-process-engineer-die-attach","title":"Staff Process Engineer (Die Attach)","company":{"id":4240,"name":"Nexperia","domain":"nexperia.com","url":"https://alion.io/company/nexperia","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":89,"open_postings":12,"ghost_share":0,"stale_share":0.25,"repost_share":0,"time_to_fill_p50_days":69,"computed_at":"2026-10-10T05:45:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Seremban, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":19500,"max_usd":45000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1382},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-09T11:36:40Z","employer_posted_date":"2026-10-09","last_verified_at":"2026-10-12T03:05:03Z","board_verified":true,"closed_at":null,"days_open":2,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":2},"description":"Position Overview\nAs a Die Bond Process Staff Engineer, you will be responsible for leading and managing all Die Attach/Die Bond manufacturing processes to achieve world-class quality, yield, productivity, and reliability performance. The role is accountable for process development, optimization, qualification, and sustaining activities while ensuring robust process control, continuous improvement, and successful new product introduction (NPI). You will lead a team of Process Engineers and work closely with Production, Equipment Engineering, Quality, R&D, Customers, and Suppliers to drive operational excellence and meet business objectives.\nKey Responsibilities (Die Bond Specific)\nOwn and manage all Die Bond process technologies, including epoxy die attach, Eutectic die bond process, and advanced die attach processes as applicable.\n\nDrive Die Bond process optimization improves yield, eliminates defects, and enhances equipment utilization.\n\nEstablish and maintain critical process controls for die placement accuracy, bond line thickness, epoxy coverage, void performance, die shear strength, and overall package reliability.\n\nLead root cause analysis and corrective actions for Die Bond-related quality excursions using 8D, DMAIC, Fishbone, DOE, and statistical methodologies.\n\nDevelop and execute process qualification plans for new materials, equipment, packages, and technology transfers.\n\nPartner with Equipment Engineering to improve machine capability, preventive maintenance strategies, uptime, OEE, and MTBA performance.\n\nLead NPI and package transfer activities involving Die Bond process development, validation, and volume ramp-up.\n\nMonitor and improve key Die Bond KPIs including:\n\nDie Placement Accuracy\n\nEpoxy Coverage Performance\n\nVoids Performance\n\nDie Shear Strength\n\nYield Loss\n\nOEE\n\nMTBA\n\nCustomer Complaint Rate\n\nDrive process characterization activities using DOE and statistical analysis to define process windows and improve robustness.\n\nEnsure compliance with IATF16949, customer requirements, Control Plans, PFMEA, SPC, and other quality management system requirements.\n\nLead customer audits, qualification reviews, failure analysis discussions, and technical presentations related to Die Bond processes.\n\nBuild technical competency of engineers, technicians, and operators through training, coaching, and mentoring.\n\nSkills / Competencies\nHard Competencies\nExpert knowledge of Die Bond process and equipment.\n\nStrong understanding of semiconductor packaging technologies.\n\nAdvanced DOE, SPC, MSA, PFMEA, Control Plan, and Statistical Analysis.\n\nFailure Analysis and Root Cause Investigation.\n\nProcess Characterization and Validation (IQ/OQ/PQ).\n\nKnowledge of epoxy materials, solder attach, sintering, and packaging reliability.\n\nStrong data analytics capability using JMP, Minitab, Excel, or equivalent tools.\n\nSoft Competencies\nStrategic leadership and talent development.\n\nEffective stakeholder management.\n\nStrong communication and influencing skills.\n\nResults-oriented and customer-focused mindset.\n\nCross-functional collaboration and project leadership.\n\nJob Specifications\nBachelor's Degree or master’s degree in engineering (Electrical, Electronic, Mechanical, Material Science, Physics, or equivalent).\n\nMinimum of 10 years of semiconductor assembly experience with at least 5 years in Die Bond process engineering leadership.\n\nProven experience managing engineers and technical teams.\n\nStrong expertise in Die Bond equipment, materials, and process optimization.\n\nExperience in NPI, package transfer, and high-volume manufacturing environments.\n\nFamiliar with Automotive Quality Standards (IATF16949, VDA, APQP, PPAP, FMEA).\n\nExperience supporting customer audits and problem-solving activities.\n\nKnowledge of Wire Bond interaction effects and package reliability is an advantage.\n\nKPIs (Die Bond Focus)\nDie Bond Yield\n\nDie Placement Accuracy Performance\n\nEpoxy Defect PPM\n\nVoid Rate\n\nDie Shear Performance\n\nOEE / Uptime\n\nMTBA\n\nCustomer Complaint Rate\n\nHold Lot Rate\n\nAction Closure Rate\n\nProcess Capability (Cp/Cpk)\n\nCost Reduction Achievement\n\nTalent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.\nD&I Statement\nAs an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.\nIn addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.","description_format":"text","description_chars":5048,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Semiconductor Manufacturing","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-09T11:36:40Z"}],"visa":[],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":0,"expected_fill_days":69,"reasons":["conf:6","velocity","win:early","comp:brand"],"computed_at":"2026-10-10T05:45:15Z"},"pay":null,"html_url":"https://alion.io/job/nexperia-staff-process-engineer-die-attach","json_url":"https://alion.io/job/nexperia-staff-process-engineer-die-attach.json","meta":{"generated_at":"2026-10-12T03:50:56Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":6094,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-13T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":4240},"rest":"https://alion.io/mcp/rest/get_company?id=4240"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fnexperia-staff-process-engineer-die-attach"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fnexperia-staff-process-engineer-die-attach"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fnexperia-staff-process-engineer-die-attach"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/nexperia-staff-process-engineer-die-attach\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fnexperia-staff-process-engineer-die-attach"}]}