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Salary
≈ $18k – $39k per year (Estimated)
Location
In office (Bac Ninh)
Seniority
Senior · 7+ years exp
Employment
Full-Time

Confirmed on the employer's own hiring board on Sep 30, 2026. First seen by Alion on Apr 1, 2026. Nexthop Systems scores C on the Alion truth index.

Overview
Company
Impact
Profile match
Meet the Nexthop team Nexthop AI is a cohesive team of professionals who are among the best in their fields with deep expertise in hardware and software development from silicon, systems and cloud. The team culture thrives on collaboration, creativity and having fun while building great products.

Company Overview

We are a high-growth startup building next-generation high-performance switching systems for hyperscale and AI data centers. Our platforms power large-scale cloud infrastructure, GPU clusters, and high-density compute environments where performance, reliability, and thermal efficiency are critical to customer operations.

Position Summary

The Liquid Cooling Process Engineer owns the manufacturing process definition, validation, and scaling of liquid-cooled network products in conjunction with NH engineering. This role bridges thermal design, mechanical design, manufacturing engineering, reliability, and supply chain to ensure liquid-cooling solutions-cold plates, manifolds, hoses, quick-disconnects, and TIMs-are repeatable, leak-free, thermally efficient, and production-scalable.

The role is critical to enabling >50-100 kW per rack architectures, supporting next-generation AI fabrics and ultra-high-bandwidth network switches without compromising reliability or serviceability.

Key Responsibilities

Process Definition & Development

  • Define end-to-end manufacturing processes in close collaboration with engineering for:
    • Direct-to-chip cold plates
    • Manifolds and distribution plates
    • Tubing, hoses, and quick-disconnects (QDs)
    • TIM application (grease, PCM, gap fillers)
  • Develop process flow diagrams, control plans, and work instructions
  • Ensure processes are DFM/DFA/DFS compliant and serviceable in field environments

NPI Execution (EVT → DVT → PVT → MP)

  • Enable fast prototyping and rapid iterative development cycles
  • Drive development of DFMEA (Design Failure Mode Effects and Analysis) with engineering
  • Support thermal hardware from early EVT through HVM ramp
  • Identify and mitigate process risks:
    • Leak paths
    • Torque variation
    • Flatness and coplanarity
    • Particulate contamination
  • Lead process validation builds and golden line definition
  • Partner with ODMs to ensure manufacturability at scale

Assembly, Tooling & Automation

  • Specify and qualify:
    • Torque tools and sequencing strategies
    • Dispensing systems for TIMs and sealants
    • Pressure and leak-test equipment (air, helium, liquid)
  • Drive semi-automated and automated solutions for:
    • Cold-plate installation
    • Hose routing and retention
    • QD (Quick Disconnect) engagement verification
  • Define poka-yoke mechanisms to prevent mis-builds

Quality, Reliability & Validation

  • Own PFMEA (Process Failure Mode Effects and Analysis) and control plans for liquid-cooling processes
  • Define acceptance criteria for:
    • Leak rate
    • Pressure decay
    • Flow resistance
    • Thermal performance
  • Support HALT/HASS, thermal cycling, vibration, and shock testing
  • Lead root-cause analysis for field and factory issues (leaks, clogging, corrosion)

Data, Monitoring & Continuous Improvement

  • Establish process KPIs:
    • Leak ppm
    • Torque Cp/Cpk
    • TIM thickness uniformity
    • Yield and rework rates
  • Integrate test data into MES and quality dashboards
  • Drive yield improvement and cost reduction through data-driven analysis

Supplier & Partner Management

  • Work closely with:
    • Cold-plate suppliers
    • Hose and QD vendors
    • TIM and sealant suppliers
    • ODM/OEM manufacturing teams
  • Qualify suppliers and define incoming quality requirements
  • Support dual-sourcing and cost-down initiatives

Required Qualifications

  • Master’s degree in Mechanical Engineering, Manufacturing Engineering, or related field
  • 7+ years experience in manufacturing and process engineering with 2+ years of liquid cooling experience
  • Hands-on experience with thermal or fluid-handling hardware
  • Strong understanding of:
    • Mechanical tolerances and torque control
    • Assembly processes and tooling
    • Manufacturing quality systems
    • Thermodynamics
    • Heat transfer
  • Experience with liquid-cooled servers, network switches, or HPC systems
  • Experience working in or with startups

Preferred Qualifications

  • Familiarity with:
    • Cold-plate design and materials (Cu, Al, Ni plating)
    • TIM characterization and dispensing
    • Leak detection methods (helium mass spec, pressure decay)
  • Experience working with hyperscalers or large ODMs
  • Knowledge of data-center cooling architectures (DLC, CDU, facility interfaces)

Key Competencies

  • Strong hands-on manufacturing mindset
  • Ability to translate thermal design into robust production processes
  • Structured problem-solving and root-cause analysis
  • Cross-functional communication and influence
  • Comfortable operating in fast-paced NPI and ramp environments

Success Metrics

  • Leak rate at factory and in field
  • Thermal performance consistency
  • First-pass yield through PVT and MP
  • NPI schedule adherence
  • Cost and cycle-time targets achieved
  • Use of automation to reduce variability and increase throughput + yield

Why This Role Matters

Liquid cooling is no longer optional for hyperscale networking. This role ensures liquid-cooled platforms can be manufactured safely, reliably, and at massive scale, enabling next-generation bandwidth and AI infrastructure without compromising uptime or quality.

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