{"id":1900028,"url":"https://alion.io/job/nokia-electrical-cm-support-engineer-operations-engineering-team","title":"Electrical CM Support Engineer - Operations Engineering Team","company":{"id":17345,"name":"Nokia","domain":"nokia.com","url":"https://alion.io/company/nokia","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"A","score":99,"open_postings":53,"ghost_share":0.019,"stale_share":0.151,"repost_share":0.094,"time_to_fill_p50_days":4,"computed_at":"2026-10-06T05:45:30Z"}},"role":"Hardware","role_family":"Hardware","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["India"],"countries":["IN"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-05T09:49:04Z","employer_posted_date":"2026-10-05","last_verified_at":"2026-10-07T00:24:57Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":1},"description":"Join our Engineering Operations Team as an Electrical CM Support Engineer, where you will be responsible for developing, qualifying, and sustaining advanced assembly and interconnect processes used in high-performance electronic products. You will work across the entire product lifecycle, from New Product Introduction (NPI) through volume manufacturing, driving process optimization, yield improvement, and root cause analysis.\nIn this role, you will support complex assembly technologies including SMT, fine-pitch PCBA, organic and mSAP-based substrates, reflow soldering, hot bar soldering, laser soldering, flip-chip assembly, and advanced packaging solutions. You will leverage inspection and analytical techniques such as X-ray analysis, cross-sectioning, microscopy, and reliability testing to ensure robust manufacturing processes and superior product quality. Our collaborative environment encourages innovation, technical leadership, and continuous improvement while solving challenging manufacturing problems.\nNI Lightpath\nDevelop, optimize, and qualify SMT, through-hole, laser soldering, hot bar soldering, flip-chip, underfill, die attach, and advanced packaging processes.\nDefine and maintain robust process windows for reflow soldering and advanced electronic assembly technologies.\nSupport New Product Introduction (NPI) from prototype builds through high-volume manufacturing.\nConduct process characterization, Design of Experiments (DOE), and process capability studies.\nLead failure analysis and root-cause investigations using X-ray, cross-sectioning, microscopy, and electrical characterization.\nPerform cross-sectional analysis to assess solder joint integrity, PCB structures, and manufacturing defects.\nDrive yield improvement, quality enhancement, process optimization, and cost reduction initiatives.\nCollaborate with design teams to ensure Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Reliability (DFR).\nDevelop manufacturing specifications, work instructions, control plans, process documentation, and qualification reports.\nWork closely with suppliers, contract manufacturers, and factory teams for reliability testing and production readiness.\n BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, Materials Science, or related field\nStrong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.\nHands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).\nProven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.\nExperience with semiconductor packaging, silicon photonics, RF/optical modules, advanced failure analysis techniques (e.g., SEM, EDS, FIB), and familiarity 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