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Hardware Development Engineer

Nokia • Mobile Networks • Network Equipment • 1 day ago
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Location
In office (Bengaluru)
Seniority
Middle · 3+ years exp

Confirmed on the employer's own hiring board on Oct 16, 2026. First seen by Alion on Aug 28, 2026. Nokia scores A on the Alion truth index.

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Nokia

Nokia is a Finnish telecommunications equipment company founded in 1865 as a paper mill, which became the world's largest mobile phone maker in the 1990s before selling that business to Microsoft in 2014. It now supplies network infrastructure to operators and enterprises, covering radio access equipment for mobile networks, optical and IP routing for transport networks, fixed broadband access, and a technologies division that licenses its cellular patent portfolio. Headquartered in Espoo and listed in Helsinki and New York, it runs Nokia Bell Labs as its research arm and has been expanding into data centre networking as operator spending has slowed.
nokia.com • HQ: Espoo, Finland • Optical Communications • Mobile Networks • Network Equipment • 5000+ employees • Est. 1865
Tech stack of Nokia
Backed by Oak Investment Partners, Mercury Fund

As an Hardware Development Engineer, you will play a crucial role in the NI ON PSE HW&TE GX Syst HW & CentEng 5 (L06) department. Your primary focus will be on thermal design, simulation, and optimization for a range of high-speed pluggable transceivers, ensuring they meet power, temperature, and reliability requirements. You will collaborate with various teams and drive thermal architecture decisions throughout the product development lifecycle.

NILightpath

  • Own thermal design, simulation, and optimization for OSFP, OSFP-XD, QSFP-DD, QSFP112, QSFP56, CFP, and future form factors.
  • Develop thermal solutions for modules supporting 25G to 1.6T applications, ensuring compliance with specifications.
  • Collaborate with mechanical, signal integrity, optics, electronics, manufacturing, and reliability teams.
  • Select and optimize thermal solutions such as heat spreaders, sinks, vapor chambers, and heat pipes.
  • Understand and manage module-to-cage thermal interfaces and host-system cooling interactions.
  • Perform thermal simulations using FloTHERM and other thermal analysis tools and optimize airflow paths, pressure drops, and component temperatures.
  • Correlate simulation results with lab measurements and drive design improvements.
  • Conduct thermal validation and testing, including thermal characterization, airflow analysis, and power dissipation testing.
  • B.E./B.Tech/M.E./M.Tech in Mechanical, Thermal, Aerospace Engineering, or related field.
  • 3+ years of electronics cooling and thermal engineering experience.
  • 2+ years of thermal design for pluggable optical modules (OSFP, QSFP-DD, CFP, SFP family).
  • Strong understanding of thermal challenges in DSP/ASIC cooling, optical engines, and laser devices.
  • Experience with FloTHERM and other thermal tools for thermal simulations and modeling.
  • Ability to correlate simulation results with lab measurements and drive design improvements.
  • Hands-on experience with thermal validation for optical transceivers or compact networking products.
  • Proficiency in thermal validation tools and techniques, including thermocouples and IR imaging.
  • Strong analytical skills, methodical approach, and excellent technical reporting abilities.
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