{"id":3531169,"url":"https://alion.io/job/nokia-silicon-photonics-packaging-engineer-co-op","title":"Silicon Photonics Packaging Engineer Co-op","company":{"id":17345,"name":"Nokia","domain":"nokia.com","url":"https://alion.io/company/nokia","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"A","score":92,"open_postings":68,"ghost_share":0.029,"stale_share":0.368,"repost_share":0.147,"time_to_fill_p50_days":9,"computed_at":"2026-11-03T05:54:40Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":null,"employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Sunnyvale, United States","New York, United 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Photonics Packaging Co-op for our Spring 2027 Term to engage in the research and development of silicon photonics transceiver modules.\nDevelop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.\nDesign optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.\nOwn Design Rules documents and ensure Design for Manufacturing specifications are met.\nPerform mechanical integrity and thermal simulations, tolerance analyses and characterization.\nDrive package debug activities during product validation and qualification.\nPlan and Drive prototype assembly builds to enable deliveries for early design validation.\nApply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.\n Experience with package and process design/development from design to production.\nKnowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.\nExperience with documentation of fabrication, inspection, and assembly processes.\nSolid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. \nIt would be nice if you also had:\nUnderstanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.\nExperience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.\nExperience in high-speed electronics package design and/or laser package design.\nExperience with thermo-mechanical simulations using ANSYS or similar software.\nExperience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.\nFamiliarity with design and simulations of optical packaging using free space optics or fiber 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