{"id":3362190,"url":"https://alion.io/job/nvidia-senior-ic-packaging-process-engineer","title":"Senior IC Packaging Process Engineer","company":{"id":6,"name":"NVIDIA","domain":"nvidia.com","url":"https://alion.io/company/nvidia","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":83,"open_postings":780,"ghost_share":0.022,"stale_share":0.586,"repost_share":0.041,"time_to_fill_p50_days":38,"computed_at":"2026-11-01T06:10:25Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Yokneam, Israel"],"countries":["IL"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":103000,"max_usd":233000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":8444},"experience_years_min":7,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-10-27T21:45:17Z","employer_posted_date":"2026-10-27","last_verified_at":"2026-11-01T01:24:15Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.\nWhat you'll be doing:\nLead adhesive and bonding process development for advanced FCBGA packaging, including surface preparation, surface coatings and process optimization for applications requiring optical alignment and high dimensional stability.\nDesign and execute Design of Experiments (DOE) for adhesive material qualification, process window definition, and process optimization including failure analysis.\nEvaluate and qualify new materials (adhesives, encapsulants, underfills) from vendors including characterization of cure chemistry, thermal stability, and mechanical properties\nDefine and own incoming material acceptance criteria and statistical process control (SPC) thresholds for production readiness\nCollaborate with partners and material suppliers to resolve process escapes, drive 8D corrective actions, and align on specification requirements\nPrepare process documentation, assembly specs, and material qualification reports\nMonitor and analyze production data to identify process trends, drive yield improvements, and ensure ongoing process control across OSAT manufacturing sites.\nWhat we need to see:\nB.Sc. or M.Sc. in Materials Science, Chemical Engineering, or a related field\n7+ years of experience in process engineering, with hands-on expertise in adhesive process development.\nProven experience with failure analysis techniques: cross-sectioning, SEM/EDX, optical microscopy, DSC, TGA, and FTIR\nWillingness and ability to travel internationally approximately 30% of the time to support OSAT partners, supplier qualifications, and on-site failure investigations\nAbility to work independently in a fast-paced, multi-program environment\nCurious and creative problem solver as well as organized and multi-tasker\nTeam oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)\nHigh awareness of quality, manufacturability and project schedule\nWays to stand out of the crowd:\nProven record in packaging development\nBackground in semiconductor manufacturing processes and optical systems","description_format":"text","description_chars":2528,"description_truncated":false,"requirements":{"experience_years_min":7,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Servers & Data Center Hardware","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-27T21:45:17Z"}],"visa":[],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":4,"expected_fill_days":38,"reasons":["conf:4","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-11-01T06:10:25Z"},"pay":null,"html_url":"https://alion.io/job/nvidia-senior-ic-packaging-process-engineer","json_url":"https://alion.io/job/nvidia-senior-ic-packaging-process-engineer.json","meta":{"generated_at":"2026-11-01T10:36:42Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":16422,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-02T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":6},"rest":"https://alion.io/mcp/rest/get_company?id=6"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fnvidia-senior-ic-packaging-process-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fnvidia-senior-ic-packaging-process-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fnvidia-senior-ic-packaging-process-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/nvidia-senior-ic-packaging-process-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fnvidia-senior-ic-packaging-process-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3362190}},{"tool":"search_jobs","arguments":{"company":"nvidia.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3362190},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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