{"id":3941541,"url":"https://alion.io/job/nvidia-senior-mechanical-hardware-design-engineer-ic-product","title":"Senior Mechanical Hardware Design Engineer, IC Product","company":{"id":6,"name":"NVIDIA","domain":"nvidia.com","url":"https://alion.io/company/nvidia","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":83,"open_postings":806,"ghost_share":0.026,"stale_share":0.587,"repost_share":0.06,"time_to_fill_p50_days":42,"computed_at":"2026-11-10T06:52:35Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Yokneam, Israel"],"countries":["IL"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Advantest / Teradyne ATE","optional":false},{"name":"GD&T","optional":false},{"name":"InfiniBand","optional":false}],"status":"live","first_seen_at":"2026-11-08T15:40:05Z","employer_posted_date":"2026-11-08","last_verified_at":"2026-11-10T18:12:18Z","board_verified":true,"closed_at":null,"days_open":2,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":2},"description":"NVIDIA is looking for a HW Mechanical Engineer to join the IC Product Engineering HW team. You will lead the mechanical design and execution of test hardware for NVIDIA’s networking and CPO (Co-Packaged Optics) products: test boards, sockets, handler interfaces, system-level test (SLT) mechanical interfaces, and HTOL platforms.\nNVIDIA’s Networking division is a leading supplier of end-to-end InfiniBand and Ethernet connectivity solutions for data centers, including adapter cards, switches, cables and software. Our products deliver industry-leading bandwidth, performance and scalability. The IC PE HW team ensures these products are tested and qualified for high-volume production.\nWhat you’ll be doing:\nDesign, define and qualify test sockets, contactors, handler change kits and thermal solutions for high-power, high-speed devices, with full ownership of the mechanical specification, mechanical component selection, and mechanical constraints for board layout (keep-out zones, placement, stiffening). Manage the external vendors who supply them, including drawing reviews and design sign-off.\nLead lab bring-up and debug, and define the thermal and mechanical constraints of test platforms so they deploy efficiently and robustly on the production floor, while meeting high-speed signal integrity requirements.\nWork with the most advanced ATE platforms in the industry, including Teradyne UltraFLEX / UltraFLEXplus and Advantest V93K testers and probers.\nDevelop mechanical interfaces for optical systems on production ATE equipment, and define new design concepts for future CPO products.\nCollaborate with R&D and Production teams: board design, system-level test, signal integrity, layout, firmware and test engineering.\nLead HTOL (High-Temperature Operating Life) hardware platforms for reliability testing.\nWhat we need to see:\nB.Sc. in Mechanical Engineering.\n5+ years of experience as a Mechanical Design Engineer, with hands-on 3D CAD (Creo preferred)\nProven ownership of projects end-to-end, with the ability to work independently and drive multiple projects and vendors in parallel.\nUnderstanding of digital circuits, power delivery and high-speed design constraints as they affect mechanical design.\nStrong personal skills: self-learner, multi-disciplinary, able to multitask, with excellent interpersonal skills.\nWays to stand out:\nworking alongside a board design team.\nSystem-level understanding and familiarity with production environments (SLT and final test).\nHands-on experience with test sockets (pogo pin, coax), ATE handlers, and thermal control (tri-temp).\nExperience with high-power, large-body BGA packages, and with thermal analysis or simulation.\nExperience with optical or fiber interfaces in a test setup.\nExperience managing external mechanical vendors and tooling suppliers, including reviewing and approving manufacturing drawings.\nStrong GD&T and tolerance stack-up skills.\nExperience with HTOL, burn-in or other reliability test 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