{"id":3305103,"url":"https://alion.io/job/nxp-semiconductors-package-design-engineer","title":"Package Design Engineer","company":{"id":17368,"name":"NXP Semiconductors","domain":"nxp.com","url":"https://alion.io/company/nxp","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":176,"ghost_share":0,"stale_share":0.631,"repost_share":0,"time_to_fill_p50_days":44,"computed_at":"2026-10-29T05:49:05Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Nijmegen, Netherlands","Eindhoven, Netherlands"],"countries":["NL"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":66000,"max_usd":109000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":79},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AutoCAD","optional":false},{"name":"Cadence Allegro","optional":false},{"name":"GD&T","optional":false}],"status":"live","first_seen_at":"2026-10-26T00:00:00Z","employer_posted_date":"2026-10-26","last_verified_at":"2026-10-30T00:20:44Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"The Package Innovation (PI) department is an organization within NXP's Corporate Technology Office that develops advanced semiconductor packaging solutions and next-generation packaging technologies across all NXP product lines. The Package Design team is a centralized global function responsible for package development and package design execution across NXP. This position primarily supports the Networking & Radar (NR) and Automotive Processing & Systems business lines developing advanced driver assistance, radar, Vehicle-to-Everything (V2X), wireless high-frequency connectivity, and infotainment solutions for a full spectrum of radio and amplifiers.\nPosition Summary\nResponsible for all aspects of advanced semiconductor package design for mixed signal, RF, microwave, and mmWave products, including package architecture development, die-package codesign, package layout, design rule compliance, manufacturability and reliability optimization, and technical documentation.\nThe successful candidate will work closely with BL partners, SoC designers, package engineers, project managers, simulation specialists, assembly sites including OSATs and substrate suppliers to develop package solutions that meet electrical, thermal, mechanical, reliability, manufacturability, and cost objectives.\nKey Responsibilities\nResponsible for all aspects of package design from concept through best in class solution with optimal cost, manufacturability, performance and reliability.\nUtilize various industry standard die / package co-design and layout tools for design.\nParticipate in die/package/PCB codesign activities, supporting critical signal paths, package architecture, floorplanning, bump maps, stackups, and routing implementation.\nDesign and optimize package structures for RF and mmWave applications, including controlled-impedance routing, grounding, shielding, and signal-launch structures.\nCollaborate with simulation engineers to evaluate electrical performance, SI/PI, EM behavior, and implement design improvements.\nSupport package design reviews, manufacturability assessments, design-rule compliance, and release documentation.\nPartner with assembly sites, OSATs, substrate suppliers, and cross-functional teams to deliver robust, manufacturable package solutions.\nProvide technical guidance on package architecture, substrate technologies, assembly processes, and RF package implementation.\nQualifications\nBachelor's or Master's degree in Electrical, Mechanical, Materials Engineering, or equivalent.\nTechnical experience in the following areas:\nFive plus years direct experience designing flip chip and wire-bond substrate-based and WLCSP/FOWLP semiconductor packages.\nExpert proficiency with Cadence Allegro Package Designer (APD) and AutoCAD required.\nExperience with die-package-PCB codesign methodologies desired.\nKnowledge of Power Integrity and Signal Integrity (PISI) and high-speed signal routing, differential pair implementation, return-path management, and impedance-controlled interconnect design a plus.\nStrong understanding of substrate technologies including design rules as well as Geometric Dimensioning and Tolerancing.\nExperience with or extensive exposure to primarily analog SoC design prefrred.\nPersonal Attributes\nEffective written, verbal and presentation communication skills.\nStrong technical leadership and problem-solving skills.\nDemonstrated ownership and accountability for technical deliverables.\nSelf-motivated and capable of driving technical execution with minimal supervision.\nStrong collaboration and teamwork skills in a global engineering environment.\nMore information about NXP in the Netherlands...\n#LI-c856","description_format":"text","description_chars":3664,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","RF & Wireless Hardware","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-27T01:03:26Z"}],"visa":[],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":3,"expected_fill_days":44,"reasons":["conf:3","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-10-29T05:49:05Z"},"pay":null,"html_url":"https://alion.io/job/nxp-semiconductors-package-design-engineer","json_url":"https://alion.io/job/nxp-semiconductors-package-design-engineer.json","meta":{"generated_at":"2026-10-30T01:19:29Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":1810,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-31T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":17368},"rest":"https://alion.io/mcp/rest/get_company?id=17368"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fnxp-semiconductors-package-design-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fnxp-semiconductors-package-design-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fnxp-semiconductors-package-design-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/nxp-semiconductors-package-design-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fnxp-semiconductors-package-design-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3305103}},{"tool":"search_jobs","arguments":{"company":"nxp.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3305103},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}