{"id":374694,"url":"https://alion.io/job/nxp-semiconductors-senior-physical-design-engineer","title":"Senior Physical Design Engineer","company":{"id":17368,"name":"NXP Semiconductors","domain":"nxp.com","url":"https://alion.io/company/nxp","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":83,"open_postings":175,"ghost_share":0,"stale_share":0.669,"repost_share":0,"time_to_fill_p50_days":44,"computed_at":"2026-10-31T05:58:55Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Pune, India"],"countries":["IN"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":20000,"max_usd":53000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":18},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Ansys RedHawk","optional":false},{"name":"Cadence Innovus","optional":false},{"name":"Cadence Quantus","optional":false},{"name":"Siemens Calibre","optional":false},{"name":"Synopsys PrimeTime","optional":false},{"name":"Synopsys StarRC","optional":false}],"status":"live","first_seen_at":"2026-08-27T00:00:00Z","employer_posted_date":"2026-08-27","last_verified_at":"2026-10-31T04:34:32Z","board_verified":true,"closed_at":null,"days_open":65,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":65},"description":"Job Title: Senior Physical Design Engineer\nLocation\nPune / Bangalore / Hyderabad (Hybrid)\nExperience\n8-10 Years\nJob Summary\nWe are seeking a highly motivated and experienced Senior Physical Design Engineer to join our VLSI Physical Design team. The candidate will be responsible for delivering high-quality physical implementation of complex SoC/IP blocks from netlist to GDSII, ensuring timing, power, area, and reliability targets are met. The ideal candidate should have hands-on expertise in advanced node design implementation and signoff methodologies.\nKey Responsibilities\nOwn end-to-end physical design implementation of complex digital blocks/subsystems.\nDrive floorplanning, power planning, placement, CTS, routing, timing closure, and physical verification.\nPerform design optimization for PPA (Power, Performance, Area) targets.\nExecute timing closure across multiple operating modes and process corners.\nAnalyze and resolve setup, hold, SI, IR-drop, EM, and congestion issues.\nCollaborate with RTL, Synthesis, DFT, STA, Package, and Signoff teams to achieve project milestones.\nSupport ECO implementation and tapeout activities.\nDevelop and enhance PD methodologies, automation flows, and scripts to improve productivity.\nReview design quality and mentor junior engineers.\nWork closely with global cross-functional teams.\nRequired Technical Skills\nStrong expertise in:Floorplanning\nPower Planning\nPlacement Optimization\nClock Tree Synthesis (CTS)\nRouting\nTiming Closure\nPhysical Verification\n\nSTA & Signoff\nIn-depth knowledge of:Static Timing Analysis (STA)\nMulti-Mode Multi-Corner (MMMC) methodologies\nCrosstalk/SI Analysis\nECO Flows\nTiming Signoff\n\nPhysical Signoff\nExperience with:IR Drop Analysis\nElectromigration (EM) Analysis\nDRC/LVS Closure\nReliability Checks\n\nTools\nHands-on experience with industry-standard EDA tools:\nCadence Innovus\nSynopsys ICC2\nPrimeTime\nTempus\nRedHawk / Voltus\nStarRC / Quantus\nCalibre\nEducational Qualification\nBachelor's or Master's Degree in Electronics, VLSI, Electrical Engineering, or related field.\n More information about NXP in India...\n#LI-9415","description_format":"text","description_chars":2098,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[{"name":"India","iso":"IN","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","RF & Wireless Hardware","Analog & Power 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