{"id":2517414,"url":"https://alion.io/job/nxp-semiconductors-senior-principal-packaging-engineer","title":"Senior Principal Packaging Engineer","company":{"id":17368,"name":"NXP Semiconductors","domain":"nxp.com","url":"https://alion.io/company/nxp","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":175,"ghost_share":0,"stale_share":0.623,"repost_share":0,"time_to_fill_p50_days":43,"computed_at":"2026-10-25T05:49:26Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States","Nijmegen, Netherlands","Austin, United States"],"countries":["US","NL"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":112000,"max_usd":227000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1829},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-14T10:07:43Z","employer_posted_date":"2026-10-14","last_verified_at":"2026-10-25T07:03:20Z","board_verified":true,"closed_at":null,"days_open":10,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":10},"description":"The Semiconductor Packaging Engineer will serve as an experienced technical lead within NXP’s Package Innovation organization, defining and delivering package solutions for new products and new technologies across NXP business lines. This role provides standard and advanced packaging solutions to support NXP markets including vehicle electrification and power management, robotics, and high-performance compute/datacenters, with focus on analog and power delivery.\nJob Summary:\nDefine package architectures, materials, structures, and assembly process flows that meet product requirements for reliability, performance, manufacturability, and cost.\nDrive complex cross-functional technical programs involving Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, internal assembly sites, OSATs, material suppliers, and external technology partners.\nMonitor industry trends in advanced packaging, panel-level packaging (PLP), and power packaging. Define and drive associated technology roadmaps.\nEnsure package deliverables are met for New Product Introductions (NPI) and New Technology Introductions (NTI), including feasibility assessment, package design, prototype builds, characterization, qualification, risk retirement, release, and production ramp support.\nMay involve international travel to NXP assembly sites, OSATs, suppliers, and technology partners.\nJob Qualifications:\nB.S. or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related field.\n10+ years of experience in semiconductor packaging development, package technology, assembly process development, package design, product/package engineering, or related fields.\nBroad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages.\nExperience leading cross-functional technical projects with contributors from multiple engineering, co-design, manufacturing, product, quality, supplier, and management organizations.\nAbility to communicate technical tradeoffs, risks, recommendations, and project status clearly to both technical and management audiences.\nFluent English communication skills, written and verbal.\nDeep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred.\nMore information about NXP in the United States...\nNXP is an Equal Opportunity/AffirmativeAction Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.\n#LI-97b2","description_format":"text","description_chars":3070,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Advanced (C1)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","RF & Wireless Hardware","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-14T10:07:43Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 141 · green card filings: 66","filings_12m":141,"filings_prev_12m":220,"green_card_filings_12m":66,"median_offered_wage_usd":142500,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":62,"band":"ok","label":"Likely open","p_open":1,"p_active":0.62,"p_room":1,"age_days":10,"expected_fill_days":43,"reasons":["conf:0","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-10-25T05:49:26Z"},"pay":null,"html_url":"https://alion.io/job/nxp-semiconductors-senior-principal-packaging-engineer","json_url":"https://alion.io/job/nxp-semiconductors-senior-principal-packaging-engineer.json","meta":{"generated_at":"2026-10-25T08:03:51Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":11493,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-26T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":17368},"rest":"https://alion.io/mcp/rest/get_company?id=17368"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fnxp-semiconductors-senior-principal-packaging-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fnxp-semiconductors-senior-principal-packaging-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fnxp-semiconductors-senior-principal-packaging-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/nxp-semiconductors-senior-principal-packaging-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fnxp-semiconductors-senior-principal-packaging-engineer"}]}