{"id":386486,"url":"https://alion.io/job/nxp-semiconductors-systems-ic-architect","title":"Systems IC Architect","company":{"id":17368,"name":"NXP Semiconductors","domain":"nxp.com","url":"https://alion.io/company/nxp","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":83,"open_postings":168,"ghost_share":0,"stale_share":0.696,"repost_share":0,"time_to_fill_p50_days":45,"computed_at":"2026-11-06T05:58:05Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Austin, United States","San Jose, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":152000,"max_usd":280000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":563},"experience_years_min":15,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Cadence Spectre","optional":true},{"name":"Synopsys HSPICE","optional":true},{"name":"Verilog","optional":true}],"status":"live","first_seen_at":"2026-05-17T00:00:00Z","employer_posted_date":"2026-05-17","last_verified_at":"2026-11-06T08:46:46Z","board_verified":true,"closed_at":null,"days_open":173,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":173},"description":"Locations available: San Diego and San Jose, California or Austin, Texas\nRole Overview\nWe are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies. This role is pivotal in defining next-generation Point of Load (PoL) solutions for APS, driving innovation in advanced power management with System-in-Package (SiP) integration.\nWe’re looking for a candidate to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions that meet latest system-level requirements. Key focus areas include high-performance core power for automotive applications and AI compute platforms. The role centers on Advanced Power Management for PoL solutions. Expertise in AI compute power is essential, and experience in automotive power management is a strong plus.\nKey Responsibilities - Advanced Power Management & System IC Architecture\nProduct Definition & Strategy\nOwn System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.\nDevelop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams.\nTranslate customer requirements into innovative packaging and power management solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.\nSupport development through thermal optimization and electrical analysis.\nSystem-Level Integration\nPartner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.\nLead integration of ICs and power semiconductors into advanced packages and systems. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.\nDrive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms. Knowledge of AI Compute Power Solutions is critical. Automotive Power Management experience is a plus, highly valued.\nTechnical Advisory & Reporting\nProvide strategic insights on state-of-the-art power management technologies and benchmark readiness. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.\nAnalyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.\nReport KPIs and project status to executive stakeholders.\nPreferred Qualifications:\nMaster’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).\n15+ years of experience in power semiconductors, packaging, and system-level integration. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.\nProven track record in product definition through revenue realization.\nStrong expertise in thermal management, electrical performance, and advanced reliability.\nProficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.\nExperience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued.\nExperience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508).\nDemonstrated ability to lead cross-functional, global teams and manage complex projects.\nExcellent communication and interpersonal skills; ability to collaborate across diverse teams.\nCreative mindset with strong problem-solving capabilities.\nWillingness to travel globally.\nMore information about NXP in the United States...\nNXP is an Equal Opportunity/AffirmativeAction Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.\n#LI-6aa0","description_format":"text","description_chars":4405,"description_truncated":false,"requirements":{"experience_years_min":15,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","RF & Wireless Hardware","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-09-05T22:35:40Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 141 · green card filings: 66","filings_12m":141,"filings_prev_12m":220,"green_card_filings_12m":66,"median_offered_wage_usd":142500,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":86}],"liveness":{"score":11,"band":"cold","label":"Long shot","p_open":1,"p_active":0.398,"p_room":0.28,"age_days":173,"expected_fill_days":45,"reasons":["conf:2","stale_co","velocity","win:tail","crowd:brand"],"computed_at":"2026-11-06T05:58:05Z"},"pay":null,"html_url":"https://alion.io/job/nxp-semiconductors-systems-ic-architect","json_url":"https://alion.io/job/nxp-semiconductors-systems-ic-architect.json","meta":{"generated_at":"2026-11-06T10:43:11Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":19373,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-07T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":17368},"rest":"https://alion.io/mcp/rest/get_company?id=17368"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fnxp-semiconductors-systems-ic-architect"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fnxp-semiconductors-systems-ic-architect"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fnxp-semiconductors-systems-ic-architect"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/nxp-semiconductors-systems-ic-architect\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fnxp-semiconductors-systems-ic-architect"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":386486}},{"tool":"search_jobs","arguments":{"company":"nxp.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":386486},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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