{"id":2966426,"url":"https://alion.io/job/olix-packaging-architect","title":"Packaging Architect","company":{"id":678679,"name":"OLIX","domain":"olix.com","url":"https://alion.io/company/olix","size_band":"201-500","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Ashby","truth_index":{"grade":"A","score":95,"open_postings":19,"ghost_share":0,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":89,"computed_at":"2026-10-22T06:10:10Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Austin, United States","London, United Kingdom","Bristol, United Kingdom"],"countries":["US","GB"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":200000,"max_usd":364000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":527},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"Ansys SIwave","optional":false},{"name":"Cadence Allegro","optional":false},{"name":"Cadence Sigrity","optional":false},{"name":"Mentor Xpedition","optional":false}],"status":"live","first_seen_at":"2026-10-20T21:49:48Z","employer_posted_date":"2026-10-20","last_verified_at":"2026-10-22T17:00:58Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":0,"flags":["company_stale"],"days_open":1},"description":"About OLIX\nAI is growing faster than any technology in history and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has reached its limit. A new paradigm that is faster and more efficient will be the biggest economic opportunity of the next century and create the most important company of the next decade. The OLIX Decode Accelerator 1 (DX-1) is the first accelerator architected specifically for decode. Rack-scale co-design of logic, data movement, packaging, optics and interconnect enables a step change in system level performance.\nThe Role:\nAt OLIX, the performance of our technology depends not only on silicon design, but on how effectively that silicon is packaged, integrated, and scaled into products. Packaging is a first-class element of our rack-scale co-design philosophy, and over successive product generations it will become one of our most important sources of system-level differentiation.\nThe Advanced Packaging Architect will own OLIX's packaging technology direction: defining the packaging architecture and roadmap across current and future products, and delivering the packaging solutions that turn our ASICs into high-performance systems.\nThe DX-1 provides the foundation, with a well-bounded packaging scope that must be executed to a high standard on an aggressive schedule. Beyond DX-1, our roadmap moves rapidly toward significantly more advanced packaging, with the potential for denser multi-die and chiplet-style integration, 2.5D and 3D architectures, and progressively more advanced optical integration. This role shapes that trajectory and lays the foundation for future products that will fast-follow DX-1.\nThis is a high-impact role combining hands-on engineering with architectural and strategic ownership. You will lead packaging across the full development flow for DX-1, including package architecture, detailed design, layout, simulation, and product readiness, while simultaneously defining the packaging technology strategy, partner ecosystem, and internal capability that future generations will require. As the programme scales, you will have the opportunity to build the packaging function and team around you.\nResponsibilities:\nAdvanced Package Architecture & Design\nOwn package architecture and design for ASIC-to-substrate integration, including bump/pad mapping, substrate escape, interconnect strategy, package floorplanning, and stack-up definition\n\nLead the development of 2.5D and 3D package architectures for future OLIX product variants, including multi-die integration, chiplet-style interfaces, and heterogeneous integration approaches\n\nDefine package structures that meet electrical, thermal, mechanical, reliability, and manufacturability requirements\n\nTranslate silicon and system requirements into practical package design rules, routing constraints, and implementation strategies\n\nFull Package Design Flow\nOwn or direct the full package design flow, from concept definition through detailed design, analysis, layout, verification, release, and manufacturing support\n\nDevelop and review package layouts including die placement, substrate routing, power/ground distribution, high-speed interface breakout, and physical integration constraints\n\nOwn or direct PI/SI simulation activities to validate signal integrity, power delivery, and package performance, translating results directly into design improvements and sign-off decisions\n\nSupport package-to-board co-design, including substrate layout and PCB layout/interface definition where required\n\nEnsure strong alignment between die, package, substrate, and board-level implementation\n\nOversee package database management, design reviews, sign-off, and release readiness\n\nCapability & Team Building\nEstablish OLIX's packaging engineering capability: methodologies, design libraries, templates, rules, tool flows, and workflows that support efficient and repeatable development across product generations\n\nDefine the hiring roadmap for the packaging function and, as the programme scales, build and lead a team of packaging engineers while remaining a hands-on technical contributor\n\nMentor engineers across adjacent disciplines on packaging-aware design practices\n\nSupport tool flow development and integration across package, substrate, simulation, and PCB environments\n\nCross-Functional Engineering\nWork closely with ASIC, optics, mechanical, thermal, and systems engineers to optimise package performance and system integration\n\nCollaborate with substrate vendors, OSATs, foundries, and external partners on stack-ups, design rules, implementation feasibility, and manufacturing readiness\n\nEnsure package design decisions support broader product requirements including manufacturability, reliability, serviceability, and scale\n\nAct as the key interface between package design and adjacent engineering domains\n\nManufacturing & Productisation Support\nEnsure package designs are aligned with assembly, qualification, reliability, and manufacturing requirements\n\nLead DFM/DFX activities for advanced package technologies and substrate implementations\n\nSupport prototype build, bring-up, qualification, and early production with strong technical ownership of packaging-related issues\n\nParticipate in root cause analysis and corrective action for packaging or integration issues identified during build, test, or reliability assessment\n\nReview substrate deliverables, fabrication outputs, and manufacturing documentation for completeness and technical quality\n\nSkills & Experience\n10+ years' experience in advanced semiconductor packaging for ASIC or other high-performance products\n\nDemonstrated ownership of packaging architecture, technology strategy, or roadmap development for complex products\n\nDeep expertise in front-end package design, including ASIC-to-substrate integration\n\nStrong experience with 2.5D and/or 3D package architectures, including multi-die and heterogeneous integration\n\nStrong hands-on capability with package design tools such as Cadence Allegro X APD, Siemens Xpedition, or equivalent\n\nExperience leading package development across layout, simulation, verification, and release\n\nStrong PI/SI simulation capability, including package-level signal integrity and power delivery analysis using tools such as Ansys SIwave, Cadence Sigrity, or equivalent\n\nExperience in substrate design and package-to-board integration\n\nExperience building packaging capability, processes, or teams, or leading engineers while remaining a hands-on contributor\n\nStrong working relationships with substrate vendors, OSATs, and foundry packaging organisations\n\nGood understanding of manufacturability, interconnect technologies, and package reliability\n\nStrong technical judgement, communication, and problem-solving skills\n\nDegree in a relevant engineering or physical sciences discipline\n\nDesirable\nExperience with AI accelerators, high-performance compute, networking, or advanced data-centre hardware\n\nFamiliarity with wafer-level packaging and emerging advanced packaging platforms\n\nExposure to optical or photonic integration with electronic packaging\n\nFamiliarity with package reliability, qualification, and failure analysis workflows\n\nExposure to new product introduction and scaling advanced package technologies into production\n\nCompensation & Equity\nCompetitive Salary: commensurate with your experience, skills, and location.\n\nEquity & Ownership: Meaningful stock options. You're not just joining the mission; you're owning a piece of it.\n\nProximity Bonus: We value your time. To minimise your commute and maximise your life, we offer an annual Living-Local Bonus if your residence is within 20 minutes of the office.","description_format":"text","description_chars":7808,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[]},"benefits":["Equity","Stock options"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-21T00:20:34Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"green card filings: 1","filings_12m":0,"filings_prev_12m":1,"green_card_filings_12m":1,"median_offered_wage_usd":107500,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":1,"expected_fill_days":89,"reasons":["conf:0","velocity","win:early"],"computed_at":"2026-10-22T06:10:10Z"},"pay":null,"html_url":"https://alion.io/job/olix-packaging-architect","json_url":"https://alion.io/job/olix-packaging-architect.json","meta":{"generated_at":"2026-10-22T18:16:14Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":793,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-23T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":678679},"rest":"https://alion.io/mcp/rest/get_company?id=678679"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Folix-packaging-architect"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Folix-packaging-architect"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Folix-packaging-architect"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/olix-packaging-architect\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Folix-packaging-architect"}]}