{"id":3730238,"url":"https://alion.io/job/onsemi-assembly-quality-engineer","title":"Assembly Quality Engineer","company":{"id":58717,"name":"onsemi","domain":"onsemi.com","url":"https://alion.io/company/onsemi","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":78,"open_postings":210,"ghost_share":0,"stale_share":0.867,"repost_share":0.005,"time_to_fill_p50_days":35,"computed_at":"2026-11-14T05:58:10Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Carmona, Philippines"],"countries":["PH"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"CAPA","optional":false},{"name":"FMEA","optional":false},{"name":"JMP","optional":false},{"name":"Minitab","optional":false},{"name":"Power BI","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-11-04T03:46:48Z","employer_posted_date":"2026-11-04","last_verified_at":"2026-11-14T17:02:45Z","board_verified":true,"closed_at":null,"days_open":10,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":10},"description":"Job Summary:\nonsemi is looking for an Assembly Quality Engineer who is responsible for ensuring product quality, process stability, and continuous improvement across Front of Line (FOL) semiconductor assembly operations, including Wafer Saw, Die Attach/Die Bond, and Wire Bond processes. This role drives defect prevention, yield improvement, customer satisfaction, and compliance with quality management system requirements through data analysis, problem-solving, process audits, and collaboration with cross-functional teams.\nMonitor and analyze quality performance metrics for Wafer Saw, Die Bond, and Wire Bond processes.\nLead investigation of assembly-related defects, yield excursions, customer complaints, and manufacturing non-conformances using structured problem-solving methodologies (8D, DMAIC, 5 Why, Fishbone Analysis).\nImplement and verify corrective and preventive actions to eliminate recurring quality issues.\nDrive continuous improvement projects focused on defect reduction, process capability improvement, yield enhancement, and cost of poor quality reduction.\nReview Statistical Process Control (SPC) data, process capability indices (Cp/Cpk), and quality trends to identify risks and opportunities for improvement.\nSupport qualification and validation activities for new products, materials, equipment, and process changes.\nConduct process, product, and system audits to ensure compliance with internal procedures, customer requirements, and industry standards.\nPartner with Manufacturing and Process Engineering teams to establish robust controls and quality checkpoints.\nDevelop and maintain quality documentation, including Control Plans, PFMEA, Inspection Standards, and Work Instructions.\nParticipate in customer audits and support responses to customer quality concerns and corrective actions.\nEnsure compliance with ISO 9001, IATF 16949 (where applicable), and company quality management system requirements.\nFacilitate containment activities during quality incidents and coordinate disposition of non-conforming materials.\nRequirements\nBachelor's Degree in Engineering (Electronics, Electrical, Mechanical, Industrial, Materials Science, or related discipline).\nMinimum 5 years of experience in semiconductor assembly manufacturing and quality engineering.\nStrong knowledge of Front of Line assembly processes including Wafer Saw, Die Attach/Die Bond, and Wire Bond.\nExperience in semiconductor quality tools and methodologies such as SPC, FMEA, MSA, Control Plans, DOE, CAPA, and Root Cause Analysis.\nWorking knowledge of semiconductor package construction, assembly materials, and reliability requirements.\nExperience in interpreting engineering drawings, specifications, and process standards.\nStrong analytical, troubleshooting, and data interpretation skills.\nProficiency in quality reporting and statistical analysis tools (Minitab, JMP, Excel, Power BI, or equivalent).\nExcellent communication and cross-functional collaboration skills.\nPreferred Skills\nExperience supporting automotive semiconductor products and IATF 16949 requirements.\nKnowledge of Lean Manufacturing and Six Sigma methodologies (Green Belt Six Sigma is an advantage).\nFamiliarity with Backend process and semiconductor reliability 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