{"id":363051,"url":"https://alion.io/job/onsemi-development-reliability-staff-engineer","title":"Development Reliability Staff Engineer","company":{"id":58717,"name":"onsemi","domain":"onsemi.com","url":"https://alion.io/company/onsemi","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":78,"open_postings":186,"ghost_share":0,"stale_share":0.898,"repost_share":0,"time_to_fill_p50_days":28,"computed_at":"2026-10-28T05:59:10Z"}},"role":"Backend","role_family":"Backend","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Scottsdale, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":142000,"max_usd":265000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1500},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":false},{"name":"JMP","optional":false},{"name":"Microsoft Office","optional":false},{"name":"Minitab","optional":false},{"name":"Power BI","optional":false},{"name":"Python","optional":false},{"name":"SQL","optional":false}],"status":"live","first_seen_at":"2026-09-03T00:00:00Z","employer_posted_date":"2026-10-23","last_verified_at":"2026-10-28T08:22:32Z","board_verified":true,"closed_at":null,"days_open":55,"trust":{"level":"ok","repost_count":1,"flags":[],"days_open":55},"description":"onsemi is seeking a Reliability Staff Engineer to join our team in Scottsdale, Arizona. You will be a key member of the cross-functional team responsible for delivering technology and products that exceed customer expectations for robustness, durability and reliability. This role plays a critical part in ensuring the robustness, durability, and lifetime performance of power semiconductor products. The successful candidate will provide technical leadership in reliability engineering with a strong focus on chip-package interactions, advanced power packaging, discrete devices, and power modules across silicon, silicon carbide (SiC), and gallium nitride (GaN) technologies.\nThis position requires deep understanding of electro-thermo-mechanical physics of failure, accelerated reliability testing, power cycling, and statistical analysis, as well as the ability to translate customer mission profiles into robust qualification strategies. The successful candidate will clearly convey complex reliability concepts, influence cross-functional stakeholders, and engage directly with customers on product reliability performance. Expected to provide technical leadership in reliability, serving as a trusted advisor to internal stakeholders and customers on power semiconductor and packaging reliability.\n The successful candidate will have to:\nInterface with Fab, Packaging, Product Engineering, Manufacturing, and Business Units.\nDefine and own NPD reliability and robustness requirements for power semiconductor products.\nLead reliability assessments for advanced power packaging technologies (e.g., sintered die attach, copper clip/ribbon, embedded die, power modules, double-sided cooling).\nAnalyze chip-package interaction effects and thermo-mechanical failure mechanisms and propose design, process, or material improvements\nInfluence package, device, and process design decisions through data-driven reliability recommendations.\nLead technical reliability discussions to align stakeholders on risk, tradeoffs, and qualification strategy.\nDesign and execute power cycling, thermal cycling, and accelerated thermo-mechanical stress tests.\nDevelop, validate, and calibrate lifetime and acceleration models based on physics of failure and test data.\nConduct early-stage FMEA and drive RCCA for reliability stress failures.\nCollaborate with internal labs on reliability testing and failure analysis.\nCorrelate accelerated stress results to customer mission profiles and application use conditions.\nCommunicate complex reliability data, physics-of-failure insights, and risk assessments clearly to technical and non-technical stakeholders.\nManage multiple projects in a fast-paced, cross-functional environment.\n Recent graduate (or will graduate by end of year) with PhD in Electrical Engineering, Materials Science, Mechanical Engineering will be considered.\n\n MS with 3-5 years of relevant experience.\nStrong understanding of physics of failure, particularly electro-thermo-mechanical mechanisms in semiconductor devices and packages.\nProven experience with chip-package interactions, package materials, and assembly processes.\nHands-on experience with power cycling reliability testing and accelerated thermo-mechanical stress.\nExperience with power semiconductor products (Si, SiC, GaN discrete devices and/or power modules).\nProficiency with structured problem-solving tools (FMEA, 8D, root cause analysis).\nExperience with statistical analysis tools (JMP, Minitab) and MS Office.\nExperience in extracting data, creating reports and dashboards using Power BI, Python, Oracle and/or SQL is a plus.\nKnowledge of industry reliability standards (JEDEC, AEC, IEC, MIL, AQG324) preferred.\nExperience working with automotive customers/OEMs is a plus.\nWillingness to travel (Excellent verbal and written communication skills in 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