Entry Level for ONSC Process Engineering (Bachelor)

JOB SUMMARY

Lead timely and effective new product introduction from engineering build through qualification and initial manufacturing release. Drive design-for-manufacturability, process readiness, first-pass qualification success, yield improvement, cost competitiveness, and smooth transfer to production in alignment with customer, business unit, technology development, quality, and manufacturing requirements.

• Lead NPI and EBR execution from feasibility review, design assessment, engineering build, process characterization, qualification, and initial manufacturing release.
• Coordinate cross-functional technical activities with Technology Development, Business Unit, Product Engineering, Process Engineering, Quality, Reliability, Planning, Manufacturing, and external partners when applicable.
• Facilitate technical discussions, risk assessments, design reviews, manufacturability reviews, and production readiness reviews before actual build, customer qualification, or change implementation.
• Define and execute process characterization, DOE, guard-band validation, process window confirmation, capability assessment, and statistical data analysis to support qualification decisions.
• Monitor engineering build performance, yield, quality indicators, process stability, and key CTQ parameters; drive issue containment, root cause analysis, corrective action, and closure.
• Prepare and maintain NPI deliverables, including qualification reports, process characterization reports, build summaries, risk assessment records, FMEA inputs, control plan updates, work instructions, and release documentation.
• Support customer, BU, and internal management reviews by providing clear technical status, risk summary, mitigation plan, schedule impact, and qualification readiness assessment.
• Follow initial manufacturing lots after qualification release, ensure lessons learned are captured, and complete structured handover to Process Engineering or sustaining engineering teams.

• Bachelor’s degree or above in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, Semiconductor Engineering, Physics, or a related technical discipline.
• Familiarity with semiconductor assembly, packaging, process flow, equipment capability, product qualification, engineering build control, and manufacturing documentation.
• Experience with power module, discrete, IC package, advanced packaging, automotive qualification, or high-reliability manufacturing environment is preferred.
• For senior level, demonstrated ability to independently lead complex NPI projects, manage cross-functional risks, influence stakeholders, and drive qualification or production release decisions.
• Solid knowledge of DOE, SPC, FMEA, control plan, OCAP, 8D problem solving, failure analysis, process capability, yield analysis, and engineering report writing.
• Good understanding of product characteristics, process interactions, material behavior, equipment capability, CTQ parameters, and qualification requirements.
• Able to gather, organize, analyze, visualize, and interpret engineering data using tools such as Excel, JMP, Minitab, Power BI, or equivalent statistical/data analysis software.
• Strong project management discipline, including milestone planning, action tracking, risk escalation, stakeholder alignment, and timely closure of technical deliverables.
• Able to work independently, manage multiple priorities, and communicate clearly with engineering, manufacturing, quality, management, customer-facing teams, and external partners.
• Good written and verbal communication skills in English; Chinese communication capability is preferred when supporting China-based customers, suppliers, or manufacturing partners.