External Manufacturing NPI Manager
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Seniority
Staff · 10+ years exp
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Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.
External Manufacturing NPI Manager
- Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
- Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
- Responsible for the team’s performance, including overall delivery, tactical & resource planning, execution and day-to-day operationalization
- Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
- Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization
- Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
- Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
- Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
- Lead by example and adoption of data analytics and data-driven approach to problem solving and decision making
- Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
- Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
- More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
- Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
- Experience in leading and mentoring a highly technical and motivated team of 10+ NPI/ process engineers
- Hands-on assembly process experience in leading wafer technology such as SiC, JFET, GaN and CIS Imaging is highly desirable
- Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
- Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
- Good overall understanding of OSAT business landscape, operations and industry trends
- Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
- Proficient in statistical analysis methods and familiar with data analytics
- Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous
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