Integration Engineer

onsemi is seeking a Manufacturing Integration Engineer in our EFK Hopewell Junction site. We are a leading innovator in semiconductor technology, dedicated to advancing power electronics through cutting-edge research and development. We are seeking a talented andmotivated staff engineer to join our team and drive Technology transfers and Manufacturability of next-generation discrete power FET technologies and CMOS. This role offers high technical ownership, cross-functional visibility, and the opportunity to directly shape onsemi’s future power device roadmap

• Technology transfer and manufacturability for onsemi’s advanced nodes of discrete power FETs, owning device architecture from concept definition through qualification and high-volume manufacturing.
• Monitor electrical performance and device performance, collaborating with design, process integration, and modeling teams to optimize Rds(on), switching performance, ruggedness, and power density.
• Partner with process module owners in the fab to optimize process windows, ensure device robustness, and resolve integration challenges.
• Perform device characterization, electrical testing, and failure analysis, ensuring compliance with specifications and customer requirements.
• Drive structured root-cause analysis (DOE, 6-sigma, SPC, FMEA) for yield, reliability, or device-related issues, and implement sustainable corrective actions.
• Collaborate with systems engineering, product engineering, packaging, and applications teams to integrate power FETs into system-level solutions and end-customer applications.
• Provide technical guidance, coaching, and mentorship to junior engineers; matrix-manage engineers across multiple organizations.
• Present technical content in executive-level reviews and represent the team in cross-functional and customer-facing discussions.

Qualifications

• Master’s or Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field.
• 5+ years of experience in semiconductor manufacturing, specifically with discrete power FETs (trench MOSFETs, superjunction, CMOS, or related structures).
• Experience with post wafer fab operations such as Back-Grind/Back Metallization, Packaging, Dicing and Singulation, module construction.
• Experience with wafer level testing, ILT/WAT/PCM and Probe. Familiarity with package level Final Testing especially for discrete power devices
• Experience taking technologies from early manufacturing to high volume ramp.
• Understanding of semiconductor physics, device reliability, and fabrication processes, including experience in 300mm fabrication.
• Demonstrated ability to translate high-level objectives into actionable engineering plans and drive projects independently.
• Strong data-driven problem-solving skills using DOE, statistical analysis, SPC, 6-sigma, and FMEA methodologies.
• Track record of leading or significantly contributing to technology development projects with measurable impact on performance, reliability, yield, or cost.
• Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences.
• Ability to manage multiple projects simultaneously in a fast-paced development environment

Salary: onsemi is excited to share the base salary range for this position is $101,700 to $172,700 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf