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Salary
$114k – $194k per year
Location
In office
Seniority
Senior · 6+ years exp
Overview
Company
Impact
Profile match
Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.

onsemi is seeking a highly motivated engineer to join our Technology Development group as an Integration Engineer at our Hopewell Junction, NY site.This will include driving continuous improvement on new processes, new product architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing.

Essential Responsibilities
  • New Product Development: Support product development from initial design through full-scale manufacturing, ensuring complete documentation for ONSEMI’s process change review process.
  • Process Optimization: Collaborate with Manufacturing Engineering to recommend and implement manufacturable process recipes that meet yield and reliability targets.
  • Technical Expertise:
    • Demonstrate understanding of semiconductor technology, device physics, yield improvement, and manufacturing processes.
    • Novel Insulator integration into wafer packaging.
    • Chip Package Interaction (CPI) experience is a plus.
    • Chip-scale module construction.
    • Power FET experience, Power Module experience.
    • Experience with copper plating and wafer thinning is a plus.
    • Key skills/experience for this position are Pick-and-place, sintering, CSP, and advanced packaging.
    • Additional skills/experience for this position are RDL, advanced packaging integration, polyimide, dicing, and module assembly.
  • Data Analysis & Tools:
    • Proficiency in MS Excel, PowerPoint, Word, and MS Project.
    • Skilled in yield analysis tools such as Shiny, Excensio, JMP, Minitab, etc.
    • Automation processing software such as SiView.
  • Cross-Functional Collaboration:
    • Work effectively within a global matrixed team and independently drive projects to completion.
    • Communicate clearly with all levels of the organization, including executive leadership.
  • Execution & Leadership:
    • Operate independently, translating high-level objectives into detailed execution plans.
    • Act as a team player with strong listening skills, able to incorporate input and make informed decisions.

Required Qualifications:

  • Education: BS in Engineering or Materials Science, MS+ preferred
  • Experience: 6-10 years or more of relevant experience in semiconductor manufacturing integration and technology development.
  • Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
  • Language Fluency - Fluent in English Language, written & verbal

Salary: onsemi is excited to share the base salary range for this position is $114,000 to $193,700 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf

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