Manufacturing Integration Engineer

onsemi is seeking a Manufacturing Integration Engineer at our EFK Hopewell Junction site. We are a leading innovator in semiconductor technology, dedicated to advancing power electronics through cutting-edge research and development. We are seeking a talented and motivated Engineer to join our team and drive technology transfer and Manufacturability of next-generation discrete power FET technologies. This role offers high technical ownership, cross-functional visibility, and the opportunity to directly shape onsemi’s future power device roadmap

• Technology transfer and manufacturability for onsemi’s advanced nodes of discrete power FETs, with device architecture ownership from concept definition through qualification and high-volume manufacturing.
• Partner with process module owners in the fab to optimize process windows, ensure device robustness, and resolve integration challenges.
• Perform device characterization, electrical testing, and failure analysis to ensure compliance with specifications and customer requirements.
• Drive structured root-cause analysis (DOE, 6-sigma, SPC, FMEA) for yield, reliability, or device-related issues, and implement sustainable corrective actions.
• Collaborate with systems engineering, product engineering, packaging, and applications teams to integrate power FETs into system-level solutions and end-customer applications.
• Present technical content in executive-level reviews

Qualifications

• Master’s or Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field.
• 2+ years of experience in semiconductor manufacturing, specifically with discrete power FETs (trench MOSFETs, superjunctions, or related structures).
• Understanding of semiconductor physics, device reliability, and fabrication processes, including experience in 300mm fabrication.
• Experience taking technologies from early manufacturing to high volume ramp.
• Demonstrated ability to translate high-level objectives into actionable engineering plans and to drive projects independently.
• Strong data-driven problem-solving skills using DOE, statistical analysis, SPC, 6-sigma, and FMEA methodologies.
• Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences.
• Ability to manage multiple projects simultaneously in a fast-paced development environment
• Prefer experience with post-wafer fab operations, including Back-Grind/Back Metallization, Packaging, Dicing and Singulation, and module construction.
• Prefer experience with wafer level testing, ILT/WAT/PCM and Probe. Familiarity with package-level final testing, especially for discrete power devices

Salary: onsemi is excited to share the base salary range for this position is $75,300 to $120,400 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf