Package Development Engineer
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In office
Seniority
Staff · 8+ years exp
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Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.
Lead the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based (FC-BGA, FC-LGA) and leadframe-based technologies. Drive package development from concept through production while working closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, reliable, and cost-effective products.
- Lead package development activities from concept, design, qualification, and production release.
- Develop and optimize substrate-based and leadframe-based flip-chip package technologies.
- Drive package architecture, material selection, assembly process development, and manufacturability improvements.
- Support flip-chip integration, including bumping, underfill, reflow, molding, and singulation process optimization.
- Develop qualification plans and assess package reliability performance.
- Lead root-cause investigations and corrective actions for package, assembly, and reliability issues.
- Collaborate with OSATs and suppliers on process development, yield improvement, and cost reduction initiatives.
- Support NPI execution and transfer technologies into high-volume manufacturing.
- BS/MS in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
- 8+ years of semiconductor package development experience.
- Strong expertise in:
- Flip-chip packaging technologies
- FC-BGA and FC-LGA packages
- FC-QFN, FC-DFN, DrMOS, and SPS packages
- Leadframe and substrate packaging processes
- Package reliability and qualification
- Knowledge of DOE, DFMEA, SPC, 8D, and statistical problem-solving methodologies.
- Experience working with OSATs, substrate suppliers, and material vendors.
- Strong technical leadership and project management skills.
- Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
- Proven ability to lead projects across organizations and cultures in a fast-paced environment.
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