Process Engineer Section Manager
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Location
In office (Lapu-Lapu)
Overview
Company
Impact
Profile match
Onsemi is an American semiconductor company that was spun out of Motorola in 1999 and has since narrowed itself from a broad commodity chip supplier into a focused power and sensing business. Its silicon carbide and silicon power devices go into electric vehicle traction inverters, chargers and industrial drives, while its image sensors are used in automotive cameras and industrial vision, and it has deliberately exited lower-margin product lines to concentrate on these markets. Headquartered in Scottsdale, Arizona and listed on Nasdaq, it owns its own silicon carbide substrate manufacturing to secure supply.
Basic Purpose of the Job
- Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
- Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.
- Drive continuous improvement, standardization, process governance, and readiness for volume and package-mix expansion.
Reporting Relationship
- Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.
Major Duties and Responsibilities
- Provide strategic process ownership for all FOL Package Group (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation).
- Lead engineering responses to yield losses, top defect contributors, customer complaints, reliability audit failures, and GMRB cases.
- Oversee execution of Continuous Improvement Plan, productivity projects, and proliferation activities across CBSM, SOSM, and PPD packages.
- Ensure audit readiness (IATF/ISO/Customer), compliance to change control, and cross-functional alignment with Production, Quality, Equipment, NPI, Planning, and SQE.
- Develop technical talent, strengthen process ownership, and balance engineering workload.
- Education
- Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field).
- Experience
- 8+ years in semiconductor assembly (Die Attach / Wire Bond), with proven leadership in high-mix, high-complexity FOL operations.
- Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan, and equipment/materials qualification.
- Skills & Knowledge Requirements
- Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma) and failure mechanisms.
- Excellent analytical skills (Minitab/Exensio/SPC), problem-solving (8D, DMAIC), and audit/customer-facing communication.
- Ability to lead teams, manage cross-functional escalations, and sustain process governance under high-volume/high-complexity environments
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