Process Engineering Wirebond

Wire Bond Process Engineer optimizes, sustains, and develops ultrasonic wire bonding processes to enhance yield, quality, and cost-efficiency in semiconductor manufacturing. Key duties include managing New Product Introductions (NPI), conducting DoE (Design of Experiments) for process optimization, troubleshooting defects (bond lifts, wire breaks), and mentoring junior staff.

• Process Optimization & Development: Define, develop, and document wire bonding recipes and parameters (parameters, tools, materials) for new and existing products.
• Yield & Quality Improvement: Analyze yield trends, implement root-cause analyses for failures (e.g., bond lifts, cratering), and drive corrective actions (PDCA) to improve Cpk/Cp and reduce DPMO.
• NPI & Qualification: Coordinate the setup, validation, and qualification of new wire bonding equipment and materials, including material characterization.
• Troubleshooting & Support: Provide technical, hands-on support to production teams, including troubleshooting wire bonders (e.g., K&S, ASM, Shinkawa, Orthodyne platforms).
• Documentation & Compliance: Create and update process specifications, Standard Operating Procedures (SOPs), FMEA, and Control Plans to meet ISO/IATF 16949 standards.
• Mentorship: Coach junior engineers and technicians on technical skills and best practices.

Education: Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Electronics, or Semiconductor Technology).

Experience: Typically 5+ years of experience in semiconductor backend manufacturing, specifically in wire bonding.

Technical Skills: Deep understanding of ultrasonic wire bonding techniques, materials (Au, Cu, Al wires), and equipment, along with strong data analysis skills (e.g., Pareto analysis, SPC).

Soft Skills: Strong problem-solving, collaboration, and communication skills to work with cross-functional teams.