{"id":182220,"url":"https://alion.io/job/onsemi-senior-power-module-electrical-simulation-engineer","title":"Senior Power Module Electrical Simulation Engineer","company":{"id":58717,"name":"onsemi","domain":"onsemi.com","url":"https://alion.io/company/onsemi","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Oracle","truth_index":{"grade":"B","score":77,"open_postings":164,"ghost_share":0,"stale_share":0.902,"repost_share":0,"time_to_fill_p50_days":25,"computed_at":"2026-10-16T05:45:00Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Scottsdale, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":116000,"max_usd":212000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1301},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AI Agents","optional":false},{"name":"Ansys HFSS","optional":false},{"name":"Ansys SIwave","optional":false},{"name":"Digital Twin","optional":false},{"name":"FastAI","optional":false},{"name":"Linux","optional":false},{"name":"Machine Learning","optional":false},{"name":"SolidWorks","optional":false},{"name":"Unix","optional":false},{"name":"PyTorch","optional":true}],"status":"live","first_seen_at":"2026-08-31T00:00:00Z","employer_posted_date":"2026-08-31","last_verified_at":"2026-10-16T19:46:38Z","board_verified":true,"closed_at":null,"days_open":46,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":46},"description":"onsemi is seeking a self-driven and motivated professional to join our Corporate Central Engineering modeling and simulation team, located in Scottsdale, AZ or San Jose, CA. As a Senior Power Module Electrical Simulation Engineer, you will support the development of next-generation power modules and power delivery solutions for AI data center applications - driving new package and system integration, new product design, assembly and process development, quality and reliability, and worldwide customer engagements. As AI compute pushes power demands to unprecedented current densities, you will help shape the power module architectures that make high-efficiency, high-reliability data center power delivery possible.\n The successful candidate will have the opportunity to:\nPerform power module, package, and system-level integration electrical simulation for AI data center power delivery applications\nModel electrical-thermal-mechanical interaction for next-generation breakthrough power modules, including SiC and GaN wide-bandgap devices, ISG chiplet, ASG, and 3D integration\nExtract and analyze parasitic RLC (resistance, loop inductance, capacitance) of module layouts, busbars, interconnects, and packaging to minimize switching loss, overshoot, and EMI\nPerform high-frequency simulation including S-parameter and power integrity/PDN analysis under fast AI compute load transients\nConduct electro-thermal co-simulation to predict junction temperatures, current sharing, and hotspots against reliability and derating targets\nAnalyze and correlate modeling results to measured data from power module hardware\nDevelop and maintain state-of-the-art system integration, electrical, and electro-thermal modeling methodologies to improve modeling efficiency and accuracy\nSet up and maintain the HW/SW environment for electrical-thermal-mechanical modeling\nProvide power module electrical modeling support to field, application, and customer teams\nDrive innovation of new power module technology through simulation\nDevelop advanced simulation methodologies such as AI/machine learning algorithms, AI agents, digital twins, and probabilistic and optimization methods\n PhD degree (or Master's degree with 3 years' experience) in Electrical Engineering, electrical simulation, or Physics with e-simulation\n\nExperience and skills in electrical modeling and simulation at the power module, package, and system level\n\nUnderstanding of power semiconductor devices (SiC, GaN, silicon), switching dynamics, and power loss mechanisms\n\nKnowledge and experience of CAD concepts and SolidWorks\n\nFamiliarity with semiconductor packaging, power module, and system integration\n\nFamiliarity with material electrical properties\n\nStrong knowledge of problem analysis and diagnosis techniques\n\nFamiliarity with package test and analysis, quality assurance, and reliability methods\n\nAbility to perform model correlation to empirical measurement\n\nFamiliarity with the Unix/Linux operating system\n\nFamiliarity with FEA software ANSYS HFSS, SIwave, Q3D, Maxwell, and ANSYS Electronics Desktop\n\nStrong English communication capability\n\nStrong learning capability\n\nGood team 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