Staff Process Engineer - Die Attach / Clip Attach

The Die Attach /Clip Attach (Solder) Engineer own, develop, and sustain the solder die attach & clip attach process to achieve stable yields, high equipment uptime, and full compliance to reliability and customer requirements. The role demands wide semiconductor manufacturing experience across high-mix assembly, rigorous process controls, and data-driven problem solving to support both NPI ramp and high-volume manufacturing.

ØProcess Ownership & Control

• Define, sustain and optimize key die attach parameters and tooling effectiveness.
• Establish and maintain the recipe management system, process/set-up controls, process capability, process performance (Ppk).
• Generates and maintain PFMEA, Control Plan, Work Instruction (WI), One Point Lesson (OPL), reaction plans (OCAP)

ØYield & Quality Improvement

• Lead problem solving using 8 Discipline for internal and external issues such as customer complaints (EFAR).
• Knowledgeable in DMAIC approach for continuous improvement projects.
• Well verse in using the root cause analysis tools such as 5-Whys/Ishikawa for issues induced by the die attach process especially for GMRB documentation
• Reduce ppm loss and scrap disposition through targeted DOEs, parameter windows process validation, and direct material/tooling improvements.

ØEquipment & Materials Engineering

• Own the effectiveness of the recipe management system, drives tooling design and qualification.
• Qualify materials (solder paste/DAF, flux, substrates/leadframes, plating finishes) and define incoming/line qualification criteria.

ØCompliance & Audits

• Prepare evidence for customer audits, IATF/ISO, and internal audits
• Ensures compliance to change control management.

ØCross-Functional Leadership

• Partner with Production, Equipment, Quality, PE, NPI, Planning, SQE to ensure output, OEE, quality and delivery goals.
• Education

oBachelor’s degree in Engineering (Industrial, Mechanical, Electronics, Chemical or related engineering field).

• Experience

o10+ years of semiconductor manufacturing experience, with ≥8 years dedicated to solder die attach / clip attach process for module packages.

oHands-on with die bonders/reflow platforms (ASM, ESEC or equivalent) and high-mix, high-reliability products.

oProven track record in capability studies (Cp/Cpk), and DOE.

• Skills and Knowledge Requirement
• Deep understanding of solder metallurgy, wetting, void mechanisms, thermal management, surface finishes (ENIG/ENEPIG/Ag/Pd).
• Strong in SPC, MSA/GR&R, PFMEA, Control Plans and engineering documentation.
• Proficient in data analysis (e.g., Minitab/Exensio/Excel) and interpreting bonding diagrams/ engineering drawings.