TW_感測器研發_Packaging Development Engineer
Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to improve quality of life all across the globe. Welcome to Bosch.
博世集團於1990 年開始在台灣營運，2006年10月整合台灣地區各事業單位，成立在台事業總部，命名為台灣羅伯特博世股份有限公司。自此即開始為在地客戶提供提升其生活品質的產品與服務。由於我們持續不斷的投資及發展，目前博世在台有三個分公司以及四個研發中心。博世在台提供的產品包含汽車原廠零件、汽車零件售後服務、電動自行車系統、傳動與控制系統、安防通訊系統、熱能產品、電動工具、家電產品以及微機電感測器等。 在台灣，博世同時也致力於履行企業社會責任，長期投入在道路安全、環境保護及社會關懷之重點領域。在2013年，台灣博世展開長期的「博世成就愛」社會公益計畫，並舉辦了數場提倡摩托車道路安全的校園宣導活動，同時也與台灣社會大眾分享了博世低碳最佳範例為環保盡一份心力。 台灣博世身為全球科技與服務之領導廠商博世集團旗下的一員。博世集團的策略性目標是藉由創新實現互聯生活，在全球透過創新及激發熱情的產品與服務，提升人們的生活品質。簡言之，博世期許能「以科技成就生活之美 」。
- Packaging Development Engineer for MEMS products
- Package design and process development in co-operation with supplier and product engineering team for electronic sensors.
- Develop and optimize assembly processes for MEMS in automotive and consumer-electronics acoustic applications.
- Oversee sample manufacturing and process qualification at assembly partners.
- Team work in English language with a multitude of international interfaces is mandatory.
- 3-8 Years experience in packaging/assembly of semiconductors components, especially familiar with LGA, BGA, DFN, WLCSP, SiP, micro-phone
- Preferred solid technical background in assembly technology. Experience with acoustic device development is a plus.
- Passion for developing technical solutions in multidisciplinary international projects
- Experience in international corporation
- Excellent English skills (verbal and written); willingness to travel as required.
- Good teamwork with multitude of international interfaces