{"id":3510146,"url":"https://alion.io/job/poet-technologies-principal-engineer-radio-frequency","title":"Principal Engineer, Radio Frequency","company":{"id":2104401,"name":"POET Technologies","domain":"poet-technologies.com","url":"https://alion.io/company/poet-technologies","size_band":"51-200","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":null,"truth_index":null},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"explicit","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":7500,"max":11000,"currency":"SGD","period":"month","gross":true,"usd_annual":103128},"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Ansys HFSS","optional":false},{"name":"Ansys SIwave","optional":false}],"status":"live","first_seen_at":"2026-10-30T00:00:00Z","employer_posted_date":null,"last_verified_at":"2026-10-30T00:00:00Z","board_verified":false,"closed_at":null,"days_open":7,"trust":{"level":"not_scored","repost_count":null,"flags":[],"days_open":7},"description":"Responsibilities\nDefine and lead the RF/microwave design strategy across our photonic and semiconductor product lines, setting technical direction for antenna, matching network, and high-frequency interconnect architecture.\nServe as the top technical authority on RF/EM simulation, providing expert guidance on Ansys HFSS, SIwave, Q3D, and ADS to resolve the most complex signal and power integrity challenges.\nLead RF measurement and validation strategy, including S-parameter testing, antenna far-field characterization, and anechoic chamber measurement programs, and establish best practices across teams.\nProvide technical leadership and mentorship to SI/PI, hardware, and packaging engineers, ensuring RF performance is preserved across the full signal chain, from chip package through PCB.\nOwn resolution of critical, escalated RF issues including impedance mismatch, insertion loss, return loss, and EMI/EMC compliance, acting as the final technical escalation point.\nDrive RF design strategy for new product introduction (NPI), partnering with cross-functional leadership to align technical roadmaps with business priorities.\nAuthor and review technical documentation, design standards, and specifications for RF subsystems across the organization.\nRepresent RF engineering capability with external partners, PCB fabrication/assembly vendors, and key customers.\nTrack emerging high-frequency protocols and industry standards (100G/200G/400G/800G) and translate them into forward-looking design roadmaps.\nMentor and develop junior and mid-level RF engineers, building organizational depth in RF competency.\nRequirements\nBachelor’s, Master’s, or Ph.D. in Electrical Engineering, RF/Microwave Engineering, or a related field.\nMinimum 10+ years of RF/microwave design experience, with a demonstrated track record of technical leadership.\nDeep expertise in EM simulation tools such as Ansys HFSS, SIwave, Q3D, and ADS, with demonstrated ability to resolve highly complex RF challenges.\nExtensive hands-on experience with RF measurement equipment, including Vector Network Analyzers (VNA) and antenna far-field measurement systems.\nDeep understanding of RF fundamentals, including impedance matching, S-parameters, antenna theory, and EMI/EMC principles.\nDemonstrated experience leading or mentoring engineering teams.\nStrong track record of cross-functional collaboration at a senior level.\nExcellent written and verbal communication skills in English, with the ability to communicate technical strategy to senior leadership.\nPreferred Qualifications\nExperience in optical communications or semiconductor packaging environments at a senior or principal level.\nDeep familiarity with high-speed protocols such as PCIe, DDR, or high-speed SerDes.\nExperience with chip-package-board co-design and simulation at scale.\nTrack record of leading mass production ramp and yield improvement initiatives.\nPatents or publications in RF/microwave design.\nLocation\nThis role can be based in Singapore, China, or Taiwan.\nSkills\nMaster Control, Inter-professional Collaboration, Cross-Functional Team Leadership, Team Mentoring, Implementation of Best Practices, HFSS, Antennas, Antenna Design, Field instrumentation, Relationships With External Vendors, RF Planning, Technical Leadership, Design Standards, Electrical Engineering, Escalation Point","description_format":"text","description_chars":3335,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[{"name":"China","iso":"CN","kind":"country"},{"name":"Taiwan","iso":"TW","kind":"country"},{"name":"Singapore","iso":"SG","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["AI Chips & Accelerators","Optics & Photonic Components"],"lifecycle":[{"event":"open","at":"2026-10-30T06:30:55Z"}],"visa":[],"liveness":{"score":90,"band":"hot","label":"Hiring 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