2026 Intern-Modem Firmware DSP Engineer
Confirmed on the employer's own hiring board on Oct 24, 2026. First seen by Alion on Mar 4, 2026. Qualcomm scores B on the Alion truth index.
Company:
Qualcomm China
Job Area:
Interns Group, Interns Group > Interim Engineering Intern - SWGeneral Summary:
Candidates will participate in the design, implementation, and commercialization of modem physical layer firmware (fixed point) algorithms and control code. In addition, candidates will have the opportunity to contribute to the architectural design and evolution of current and next generation wireless modem technologies.
Candidate will design, implementation, maintain firmware internal tools which helps firmware team development and verifications.
The modem firmware team works closely with Qualcomm's world class modem systems and ASIC engineering teams to design, implement, and optimize our current modem products while also influencing the evolution of their design and inspiring the Qualcomm products of the future.
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