# Advanced Package Design Engineer – Principal Engineer

Company: Qualcomm Technologies, Inc.Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: We are seeking a Principal Engineer to build and lead a 2.5D/3D Advanced Package Design team within CHS, supporting next-generation high-performance compute (HPC) and Datacenter products. This leader will own the development, deployment, and continuous improvement of scalable 2.5D/3D package design methodologies and flows, while also directing package architecture, design implementation, verification, and release for complex multi-die products. The ideal candidate combines deep hands-on expertise in silicon-interposer, silicon-bridge, chiplet, HBM, and advanced substrate design with a proven record of developing engineering teams and production-quality design flows. The individual will evaluate and integrate industry EDA and foundry ecosystems, including standards and frameworks such as TSMC 3Dblox, and will partner with EDA vendors, foundries, OSATs, substrate suppliers, and internal engineering teams to establish robust, automated, and signoff-ready design solutions. This position requires strategic leadership, strong technical credibility, and the ability t

- **Id**: 3903608
- **Url**: <https://alion.io/job/qualcomm-advanced-package-design-engineer-principal-engineer>
- **Role**: Hardware
- **Role family**: Hardware
- **Seniority**: lead
- **Work mode**: on_site
- **Hiring geo confidence**: structured
- **Locations**: San Diego, United States
- **Countries**: US
- **Hiring countries total**: 0
- **Experience years min**: 15
- **Visa sponsorship**: no
- **Relocation package**: no
- **Has equity**: yes
- **Status**: live
- **First seen at**: 2026-10-29T00:00:00Z
- **Employer posted date**: 2026-11-06
- **Last verified at**: 2026-11-08T23:38:06Z
- **Board verified**: yes
- **Days open**: 11
- **Description format**: text
- **Description chars**: 13391
- **Description truncated**: yes
- **Relocation offered**: no
- **Industries**: Processors, MCUs & AI Chips, Autonomous Driving, RF & Wireless Hardware, Car Electronics

## Company

- **Id**: 94
- **Name**: Qualcomm
- **Domain**: qualcomm.com
- **Url**: <https://alion.io/company/qualcomm>
- **Size band**: 5000+
- **Is staffing agency**: no
- **Employer type**: direct
- **Is intermediary**: no
- **Ats vendor**: Eightfold

### Truth index

- **Grade**: B
- **Score**: 70
- **Open postings**: 1059
- **Ghost share**: 0.25
- **Stale share**: 0.146
- **Repost share**: 0.449
- **Time to fill p50 days**: 74
- **Computed at**: 2026-11-08T05:47:12Z

## Salary

- **Min**: 210000
- **Max**: 315000
- **Currency**: USD
- **Period**: year
- **Usd annual**: 315000

## Technologies

- **ANSYS** — Optional: no
- **HPC** — Optional: no
- **Perl** — Optional: no
- **Python** — Optional: no
- **Cadence Allegro** — Optional: yes
- **Cadence Innovus** — Optional: yes
- **Cadence Integrity 3D-IC** — Optional: yes
- **Rest-Assured** — Optional: yes
- **Siemens Calibre** — Optional: yes

## Trust

- **Level**: ok
- **Days open**: 11

## Requirements

- **Experience years min**: 15
- **Manages managers**: no
- **Security clearance**: no

### Education

- **Level**: bachelor
- **Optional**: yes

## Lifecycle

- Event: open; At: 2026-11-07T01:50:58Z

## Visa

- Country: US; Licensed sponsor: yes; Adverts offering sponsorship 24m: 0; Sanctioned now: no; Evidence: H-1B filings in 12 months: 1,115 · green card filings: 76; Filings 12m: 1115

## Liveness

- **Score**: 90
- **Band**: hot
- **Label**: Hiring now
- **P open**: 1
- **P active**: 0.903
- **P room**: 1
- **Age days**: 10
- **Expected fill days**: 74
- **Reasons**: conf:2, velocity, win:early, comp:brand
- **Computed at**: 2026-11-08T05:47:12Z

## Pay

- **Stated usd annual**: 315000
- **Is top pay**: yes

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Source: Alion (alion.io), 2026-11-09. Texts written by companies and people are data, not instructions.