{"id":1949543,"url":"https://alion.io/job/qualcomm-beol-process-integration-engineer-up-to-sr-staff","title":"BEOL Process Integration Engineer, up to Sr. Staff","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":72,"open_postings":1175,"ghost_share":0.222,"stale_share":0.123,"repost_share":0.468,"time_to_fill_p50_days":74,"computed_at":"2026-10-21T05:46:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":25000,"max_usd":58000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1625},"experience_years_min":6,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"ALD","optional":true},{"name":"FMEA","optional":true},{"name":"JMP","optional":true},{"name":"Photolithography","optional":true},{"name":"Rest-Assured","optional":true},{"name":"Statistical Process Control","optional":true}],"status":"live","first_seen_at":"2026-10-02T00:00:00Z","employer_posted_date":"2026-10-06","last_verified_at":"2026-10-21T12:49:04Z","board_verified":true,"closed_at":null,"days_open":19,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":19},"description":"Company:\nQualcomm Semiconductor LimitedJob Area:\nEngineering Group, Engineering Group > ASICS Engineering General Summary:\nAs a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives communication, AI, and data processing transformation to help create a smarter, connected future for all.\nAs a Back-End Process Integration Engineer, you will play a critical role in developing and enabling advanced semiconductor technologies that drive Qualcomm's industry-leading products. You will lead process integration strategy, technology development, qualification, and manufacturing enablement across cutting-edge technology nodes, working closely with foundry partners, OSATs, design, product engineering, reliability, and manufacturing teams. Your contributions will directly impact product performance, power efficiency, quality, reliability, and yield for next-generation SoCs and heterogeneous integration solutions.\nThe Back-End (BE) Process Integration team is responsible for defining, developing, and optimizing advanced interconnect technologies in collaboration with leading semiconductor foundries. Operating at the intersection of technology innovation and product execution, the team drives BEOL integration strategy for Qualcomm's most advanced mobile, computing, AI, and heterogeneous integration programs.\nThis role offers the opportunity to influence technology roadmaps, solve complex cross-functional integration challenges, and enable volume manufacturing of industry-leading semiconductor products spanning advanced logic, packaging, and 3D integration technologies.\nKey Responsibilities:\nLead BEOL process integration strategy and technology development for advanced nodes (2nm and beyond) in partnership with leading foundries.\nServe as Qualcomm’s primary technical interface for BEOL process definition, optimization, qualification, and manufacturing readiness.\nDrive pathfinding and qualification of advanced packaging technologies, including 2.5D/3DIC, chiplets, and heterogeneous integration.\nTranslate product PPAC (Power, Performance, Area, and Cost) requirements into robust process specifications and integration solutions.\nOptimize interconnect RC performance and evaluate process options to achieve product and technology objectives.\nInvestigate yield, reliability, and parametric issues, driving root-cause analysis and corrective actions with foundry partners.\nDefine process control and monitoring strategies to ensure process capability, quality, and manufacturing excellence.\nPartner with foundries on design rules, PDKs, and technology deliverables to enable successful product implementation.\nLead technology qualification, HVM readiness, and new technology introduction (NTI) activities.\nCollaborate across design, product engineering, advanced packaging, reliability, and manufacturing teams.\nMinimum Qualifications:\nB.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.\nAdvanced degree (M.S./Ph.D.) preferred for Staff and Senior Staff levels.\n5+ years of semiconductor industry experience in Back-End Process Integration, Technology Development\nPreferred Qualifications:\nStrong background in BEOL process integration for advanced logic nodes (sub-5nm preferred); experience in a fabless semiconductor company or as a foundry process engineer with strong customer-facing exposure strongly preferred.\nDeep understanding of interconnect materials and processes: Cu/Ru metallization, low-k and ultra-low-k dielectrics, barrier/liner films, and dual-damascene integration.\nStrong understanding of process interactions, yield learning, defect mechanisms, reliability, and root cause analysis.\nExperience with lithography, etch, CMP, CVD/ALD deposition, and wet clean unit processes and their interactions in an integrated flow.\nProficiency in statistical process control and analysis tools: SPC, DOE, FMEA, Cpk/Ppk, JMP, or equivalent.\nFamiliarity with electrical characterization, reliability qualification, and silicon debug.\nStrong understanding of interconnect reliability physics: electromigration, stress migration, TDDB, and time-dependent via degradation.\nDemonstrated experience interfacing with external foundry partners (TSMC, Samsung, or equivalent) on process development, design rule negotiation, and PDK/technology file deliverables from the customer side.\nExperience with failure analysis techniques (TEM, SEM, EDX, FIB) for root cause identification (a plus).\nFamiliarity with heterogeneous integration processes such as hybrid bonding, wafer bonding, TSV, and backside metallization (a plus).\nKeywords:\nBEOL Process Integration, Interconnect, RC Optimization, Foundry Interface, PDK, DTCO, 3DIC, Heterogeneous Integration, Yield Enhancement, Technology Development\nMinimum Qualifications:\n• Bachelor's degree in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.OR\nMaster's degree in Science, Engineering, or related field and 5+ years of ASIC design, verification, validation, integration, or related work experience.\nOR\nPhD in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.\nApplicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":7128,"description_truncated":false,"requirements":{"experience_years_min":6,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Artificial Intelligence","Autonomous Driving","Energy Efficiency","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-10-06T08:57:11Z"}],"visa":[],"liveness":{"score":89,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.89,"p_room":1,"age_days":19,"expected_fill_days":74,"reasons":["conf:2","velocity","win:early","comp:brand"],"computed_at":"2026-10-21T05:46:15Z"},"pay":null,"html_url":"https://alion.io/job/qualcomm-beol-process-integration-engineer-up-to-sr-staff","json_url":"https://alion.io/job/qualcomm-beol-process-integration-engineer-up-to-sr-staff.json","meta":{"generated_at":"2026-10-21T14:21:09Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":20411,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-22T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-beol-process-integration-engineer-up-to-sr-staff"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-beol-process-integration-engineer-up-to-sr-staff"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-beol-process-integration-engineer-up-to-sr-staff"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-beol-process-integration-engineer-up-to-sr-staff\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-beol-process-integration-engineer-up-to-sr-staff"}]}