{"id":3858624,"url":"https://alion.io/job/qualcomm-heterogeneous-integration-physical-design-engineer","title":"Heterogeneous Integration Physical Design Engineer","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":70,"open_postings":1059,"ghost_share":0.25,"stale_share":0.146,"repost_share":0.449,"time_to_fill_p50_days":74,"computed_at":"2026-11-08T05:47:12Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"middle","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":4,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Rest-Assured","optional":true}],"status":"live","first_seen_at":"2026-11-04T00:00:00Z","employer_posted_date":"2026-11-06","last_verified_at":"2026-11-08T15:23:51Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"Company:\nQualcomm Semiconductor LimitedJob Area:\nEngineering Group, Engineering Group > ASICS Engineering General Summary:\nAs a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives communication and data processing transformation to help create a smarter, connected future for all. As a Qualcomm ASIC Engineer, you will define, model, design (digital and/or analog), optimize, verify, validate, implement, and document IP (block/SoC) development for a variety of high performance, high quality, low power world class products. Qualcomm Engineers collaborate with cross-functional groups to determine product execution path.\nKey responsibilities:\nDrive PPAC assessment and technology pathfinding for System-Technology Co-Optimization (STCO) and heterogeneous integration.\nEvaluate and develop 2.5D/3D chiplet integration solutions, including SoIC, CoWoS, WoW, hybrid bonding, interposer, and RDL technologies.\nPerform custom DRAM and 3D SRAM integration evaluation and pathfinding for advanced product development.\nDevelop and support test-chip design, mask layout, design flows, and PDK enablement for advanced silicon and packaging technologies.\nPerform layout and design analysis for advanced technology benchmarking, DFM, and product issue debugging.\nDevelop and assess advanced system PDN solutions and system-level KPIs.\nServe as a technical interface with foundries, supporting technology evaluation, design enablement, and STCO activities.\n\nDesired Skillset / Experience\nStrong experience in 2.5D/3D heterogeneous integration, STCO, and technology pathfinding.\nHands-on experience with physical design and custom layout in advanced silicon technologies, preferably sub-10nm.\nExperience with heterogeneous integration technologies such as hybrid bonding, wafer bonding, TSV, micro-bump/u-bump, RDL, and backside metallization.\nExperience with TSMC SoIC and/or CoWoS product or technology development is highly desirable.\nHands-on experience with PDK development and verification flows, including DRC, LVS, PEX, and DFM.\nProficiency with Calibre, Cadence, SVRF, TCL, and related scripting/design automation.\nExperience in test-chip design, mask layout, tapeout, and silicon execution.\nExperience with technology benchmarking and PPAC assessment for advanced technology nodes.\nKnowledge of system PDN, Power Integrity (PI), and Signal Integrity (SI) is a plus.\nExperience with process integration and/or unit process development is highly desirable.\nExperience with 3D cache/SRAM architecture and partitioning is a plus.\n\nMinimum Qualifications:\n• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.OR\nMaster's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.\nOR\nPhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.\nApplicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":4877,"description_truncated":false,"requirements":{"experience_years_min":4,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Autonomous Driving","RF & Wireless Hardware","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-11-06T07:53:20Z"}],"visa":[],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":4,"expected_fill_days":74,"reasons":["conf:2","velocity","win:early","comp:brand"],"computed_at":"2026-11-08T05:47:12Z"},"pay":null,"html_url":"https://alion.io/job/qualcomm-heterogeneous-integration-physical-design-engineer","json_url":"https://alion.io/job/qualcomm-heterogeneous-integration-physical-design-engineer.json","meta":{"generated_at":"2026-11-08T16:38:16Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":35033,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-09T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.1,"usd":0.01,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-heterogeneous-integration-physical-design-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":2,"usd":0.2},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-heterogeneous-integration-physical-design-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.1,"usd":0.01},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-heterogeneous-integration-physical-design-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-heterogeneous-integration-physical-design-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-heterogeneous-integration-physical-design-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3858624}},{"tool":"search_jobs","arguments":{"company":"qualcomm.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3858624},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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