{"id":3556615,"url":"https://alion.io/job/qualcomm-mechanical-engineer-senior-staff","title":"Mechanical Engineer, Senior Staff","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"C","score":69,"open_postings":1051,"ghost_share":0.249,"stale_share":0.149,"repost_share":0.456,"time_to_fill_p50_days":74,"computed_at":"2026-10-31T05:58:55Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Diego, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":169800,"max":254600,"currency":"USD","period":"year","gross":null,"usd_annual":254600},"salary_estimate":null,"experience_years_min":15,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"ANSYS","optional":false},{"name":"OpenFOAM","optional":false},{"name":"Rest-Assured","optional":false},{"name":"STAR-CCM+","optional":false}],"status":"live","first_seen_at":"2026-10-23T00:00:00Z","employer_posted_date":"2026-10-30","last_verified_at":"2026-10-31T12:28:45Z","board_verified":true,"closed_at":null,"days_open":8,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":8},"description":"Company:\nQualcomm Technologies, Inc.Job Area:\nEngineering Group, Engineering Group > Hardware EngineeringGeneral Summary:\nQualcomm Technologies is scaling from silicon leadership into full rack-scale data center systems. Our Qualcomm® solutions deliver purpose-built, rack-level AI inference - paired with our data center CPU roadmap - to multiple global customers solutions\nThese are complete, serviceable systems: direct to chip - liquid-cooled racks & solutions, PCIe for scale-up, Ethernet for scale-out, computing for secure workloads all managed by the Qualcomm AI Infrastructure Management Suite. With our recent announcements into high-speed connectivity, SerDes, and chiplet expertise to the platform. This role is central to helping turn that portfolio into designs our key customers & ODMs can deploy at scale.\nRole Summary\nWe are seeking a Senior Staff Engineer to drive world class thermomechanical system solutions as part of the design team. You will help shape cooling system architectures at every level of detail by leveraging your strong thermomechanical design and modelling aptitude and experience. You will\nKey Responsibilities\nSupport the design team with system thermal and liquid flow modelling at the package, server, rack and pod level. Deliver timely guidance on performance, risk, cost, feasibility. Back up that guidance with high quality and right sized analysis. \nLead partner engagements: Engage with external partners for solution development. Backstop external analysis with internal. Set expectations and drive to successful outcomes.\nExtract and keep pace with thermal power use cases: Team up to understand the thermal power use cases and power envelopes. Provide timely analysis to system engineering to help optimize the product. .\nExplore new technologies and Intellectual Property: Ensure designs are world class and cost effective. Capture IP critical to the optimized architecture. \nSupport development parter relationships: Ensure information exchanges are sufficient, timely and complete. Participate in design reviews and leverage experience to add value. \nConduct full CFD thermal simulations: Decide when to simulate and when not to. Ensure effective modelling approaches are taken. Delegate when appropriate, but contribute regularly at the lowest detailed level with ease. Help improve the analysis process flow.\nYou aren’t just doing simulations in a vacuum: Leverage your knowledge of practical mechanical engineering best practices, fabrication techniques, tolerance analysis, failure mechanisms. Leverage your design acumen to deliver solutions grounded in reality.\nMinimum Requirement s\n Education (required): A Bachelor’s degree in an approved engineering field - Mechanical, Thermal, HW Engineering (or a closely related engineering discipline) - is required.\nExperience: 15+ years in thermomechanical design.\nA portfolio of shipped products High volume products shipped at scale preferred.\nLiquid cooling: 3+ years experience with liquid cooling of high power density, high efficiency coolers, manifolds, connections.\nModelling / Simulation: Advanced, expert level skill in one or more CFD tools.\n ODM/OEM partnership: close working relationships with ODMs and OEMs across the server/rack ecosystem - joint design (JDM), manufacturing readiness, BOM and supply alignment, and executive-level partner management.\nPreferred Qualification s\nExperience with OCP rack and server architectures, including ORV3 / Open Rack Wide.\nExperience with data center rack-level and system-level thermal design.\nExperience with AI/accelerator or other high-power-density compute platforms.\nFamiliarity with server and rack mechanical design, manufacturing methods, tolerance analysis, reliability considerations, and design for high-volume production.\nExperience working directly with ODMs, OEMs, suppliers, and cross-functional engineering teams to develop and validate thermal solutions.\nFamiliarity with PCIe, Ethernet, high-speed connectivity, and other technologies relevant to modern server and rack architectures.\nExperience with microfluidic cooling technologies\nWhat Success Looks like (First 12 months)\nBecome a strong hands-on contributor to thermomechanical design and analysis for server and rack-level programs.\nDeliver timely, right-sized thermal and liquid-flow analysis that supports design decisions, identifies risk, and helps optimize system performance.\nDevelop and improve end-to-end cooling and fluid-mechanics analysis methods spanning facility interfaces, pods, racks, servers, and SoCs.\nSupport development and validation of liquid-cooling solutions with ODMs, OEMs, suppliers, and internal engineering teams.\nContribute practical mechanical and thermal engineering judgment during design reviews, helping ensure solutions are manufacturable, reliable, cost-effective, and grounded in real hardware.\nEvaluate new cooling technologies and help identify opportunities for improved performance, cost, scalability, and intellectual property.\nKeywords: Thermomechanical, thermal engineering, CFD, computational fluid dynamics, thermal simulation, thermal modeling, ANSYS Fluent, Ansys AEDT, ANSYS Icepak, STAR-CCM+, FloEFD, FloTHERM, FloTHERM XT, Simcenter 3D, COMSOL, OpenFOAM, conjugate heat transfer, CHT, fluid mechanics, heat transfer, pressure drop, flow distribution, liquid cooling, direct liquid cooling, DLC, direct-to-chip cooling, cold plate, microchannel, jet impingement, manifold, CDU, FWS, TCS, quick disconnect, QD, heat exchanger, high heat flux, high power density, server cooling, rack cooling, AI accelerator, GPU, CPU, data center, OCP, ORV3, Open Rack Wide, thermomechanical design, thermal validation, mechanical design, DFM, tolerance analysis, ODM, OEM, JDM.\nMinimum Qualifications:\n• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.OR\nMaster's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.\nOR\nPhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.\nQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nEEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nPay rangeand Other Compensation & Benefits :\n$169,800.00 - $254,600.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":9090,"description_truncated":false,"requirements":{"experience_years_min":15,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Autonomous Driving","RF & Wireless Hardware","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-10-31T01:03:22Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 55 · green card filings: 6","filings_12m":55,"filings_prev_12m":87,"green_card_filings_12m":6,"median_offered_wage_usd":122008,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":8,"expected_fill_days":74,"reasons":["conf:0","velocity","win:early","comp:brand"],"computed_at":"2026-10-31T05:58:55Z"},"pay":{"stated_usd_annual":254600,"is_top_pay":true},"html_url":"https://alion.io/job/qualcomm-mechanical-engineer-senior-staff","json_url":"https://alion.io/job/qualcomm-mechanical-engineer-senior-staff.json","meta":{"generated_at":"2026-10-31T12:35:24Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":19464,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-01T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-mechanical-engineer-senior-staff"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-mechanical-engineer-senior-staff"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-mechanical-engineer-senior-staff"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-mechanical-engineer-senior-staff\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-mechanical-engineer-senior-staff"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3556615}},{"tool":"search_jobs","arguments":{"company":"qualcomm.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3556615},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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