{"id":2484565,"url":"https://alion.io/job/qualcomm-rf-package-design-engineer-senior-staff","title":"RF Package Design Engineer, Senior Staff","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":71,"open_postings":1166,"ghost_share":0.225,"stale_share":0.125,"repost_share":0.466,"time_to_fill_p50_days":75,"computed_at":"2026-10-19T05:45:15Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Diego, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":191800,"max":287800,"currency":"USD","period":"year","gross":null,"usd_annual":287800},"salary_estimate":null,"experience_years_min":15,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"Ansys HFSS","optional":false},{"name":"Ansys SIwave","optional":false},{"name":"Cadence Allegro","optional":false},{"name":"Mentor Xpedition","optional":false},{"name":"Synopsys HSPICE","optional":false},{"name":"MATLAB","optional":true},{"name":"Perl","optional":true},{"name":"Python","optional":true},{"name":"Rest-Assured","optional":true}],"status":"live","first_seen_at":"2026-09-15T00:00:00Z","employer_posted_date":"2026-10-13","last_verified_at":"2026-10-19T22:24:46Z","board_verified":true,"closed_at":null,"days_open":35,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":35},"description":"Company:\nQualcomm Technologies, Inc.Job Area:\nEngineering Group, Engineering Group > Packaging EngineeringGeneral Summary:\nThis position is a senior leadership position responsible for leading the RF Package Design. The main role of this position is to focus on Electrical Characterization of RF Packages working with RF design leads. The RF-IC Package and system in package are for products to be used in 6G Infrastructure and 6G consumer devices including mobile phones.\nThis position requires defining the packaging roadmap and project the resource needs and/or gaps to execute the roadmap. This position will oversee both design and advancing RF packaging roadmaps and develop/extend the company's technical capabilities. A successful candidate will have a thorough understanding of RF package design and a good understanding of RF circuit design. In addition, the individual should have the ability to formulate plans based on ambiguous project definitions to move the projects forward. As part of a cross-functional development team, the candidate will interact with other essential disciplines, including RF-IC, PCB, RF-EM, System and Process Technology Development teams.\nIn addition to the technical role, the candidate is expected to manage, train, hire and mentor junior engineers. Principal engineers are expected to work across multiple geographies.\nThe responsibilities will include but not be limited to the following:\nWorking with Package designer & various RF-IC block owners (Tx, Rx, LO, PLL, ADC/DAC, etc.) to discuss bump/ball assignments, perform early analysis and discuss trade-offs to optimize the design.\n\nEstablish BKM how to extract 3D parasitic models for various RF packages in ANSYS Electronic Desk Suite (HFSS/3D Layout/Q3D/SIWave).\n\nGuide team how to troubleshoot various RF problems (DC convergence, leakage, and isolation) efficiently in testbench\n\nFurther define methodologies for RF simulations for various Package type, frequency band and IP requirements.\n\nWork with Advanced Technology team to develop more robust future RF PKG technology\n\nUpdate the design & analysis flow and automate the process\n\nCreate technical documentation and presentations\n\nRecruit and lead team of engineers. Provide technical mentoring to junior team members\n\nMinimum Qualifications:\nMaster's degree in Science, Engineering, or related field\n\n10+ years of RF Package/PCB design experience\n\nSolid understanding and experience in Electromagnetics, Transmission line theory & Crosstalk\n\nProficiency in field solvers such as Ansys HFSS, Q3D and PSI\n\nProficiency in simulation tools such as ADS and Hspice\n\nGood knowledge in design tool such as Cadence Allegro/APD/Sip or Mentor Xpedition\n\nPreferred Qualifications:\nAbility to optimize RF design & analysis flow and being able to automate it\n\nThorough understanding of Packaging technologies and industry landscape in RF Packaging\n\nFamiliarity with Analog & RF-IC design\n\nProficiency in MatLab\n\nExperience in programming language(c/c++) or scripting language (Perl/Python)is a plus\n\nPeople Management experience is a plus\n\nPh.D. with 10+ years of experience or Master’s Degree with 15+ years of experiences\n\nMinimum Qualifications:\n• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.OR\nMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience.\nOR\nPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ year of System/Package Design/Technology Engineering or related work experience.\nQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nEEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nPay rangeand Other Compensation & Benefits :\n$191,800.00 - $287,800.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":6592,"description_truncated":false,"requirements":{"experience_years_min":15,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Autonomous Driving","RF & Wireless Hardware","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-10-13T23:50:46Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 55 · green card filings: 6","filings_12m":55,"filings_prev_12m":87,"green_card_filings_12m":6,"median_offered_wage_usd":122008,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":76,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.842,"p_room":0.9,"age_days":34,"expected_fill_days":75,"reasons":["conf:3","velocity","win:mid","comp:brand"],"computed_at":"2026-10-19T05:45:15Z"},"pay":{"stated_usd_annual":287800,"is_top_pay":true},"html_url":"https://alion.io/job/qualcomm-rf-package-design-engineer-senior-staff","json_url":"https://alion.io/job/qualcomm-rf-package-design-engineer-senior-staff.json","meta":{"generated_at":"2026-10-20T00:43:24Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":1004,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-21T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-rf-package-design-engineer-senior-staff"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-rf-package-design-engineer-senior-staff"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-rf-package-design-engineer-senior-staff"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-rf-package-design-engineer-senior-staff\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-rf-package-design-engineer-senior-staff"}]}