{"id":2724485,"url":"https://alion.io/job/qualcomm-senior-engineer-ic-package-design","title":"Senior Engineer - IC Package Design","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":72,"open_postings":1182,"ghost_share":0.22,"stale_share":0.121,"repost_share":0.468,"time_to_fill_p50_days":75,"computed_at":"2026-10-17T05:46:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Bengaluru, India"],"countries":["IN"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":15000,"max_usd":41000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":23},"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Cadence Innovus","optional":false},{"name":"Mentor Xpedition","optional":false},{"name":"Python","optional":false},{"name":"Rest-Assured","optional":true}],"status":"live","first_seen_at":"2026-06-19T00:00:00Z","employer_posted_date":"2026-07-31","last_verified_at":"2026-10-18T06:38:05Z","board_verified":true,"closed_at":null,"days_open":121,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":121},"description":"Company:\nQualcomm India Private LimitedJob Area:\nEngineering Group, Engineering Group > Packaging EngineeringGeneral Summary:\nGeneral Summary:\nRole Overview\nWe are seeking anIC Package Design Engineer to support theplanning, coordination, and execution of IC package design activities across complex semiconductor product development programs.\nThis role emphasizesprogram execution, cross-functional coordination, and delivery predictability, supporting package design efforts fromearly feasibility and design planning through tapeout and manufacturing readiness. The engineer will collaborate closely withpackage designers, integration engineers, SI/PI teams, manufacturing partners, and operations teams to ensure alignment, issue tracking, and timely delivery of package milestones.\nEDA tools and automation are used primarily asenablers of execution, while the core focus of this role is ondriving clarity, managing dependencies, and reducing execution risk.\nMinimum Qualifications:\n• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.OR\nMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.\nOR\nPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.\nKey Responsibilities\nProgram Execution & Coordination (Primary Focus)\nSupport execution of IC package design programs fromearly design planning through tapeout and post-tapeout support.\n\nDevelop and maintainexecution plans, schedules, task lists, and milestone trackers.\n\nTrackrisks, issues, dependencies, and action items across package design, verification, and manufacturing activities.\n\nDriveaction item follow-up, escalation, and closure with clear ownership and timelines.\n\nPrepare and deliverstatus updates, execution summaries, dashboards, and readiness reports for project and engineering stakeholders.\n\nSupport design reviews and execution checkpoints by coordinating inputs, capturing outcomes, and tracking follow-up actions.\n\nUse project and program management tools (e.g., dashboards, Gantt charts, milestone trackers, dependency maps) to provide clear visibility into execution status.\n\nCross-Functional & External Engagement\nCoordinate acrossPackage Design, Package Integration, SI/PI, and Operations teams to ensure execution alignment.\n\nWork closely withPackage Process teams to align design assumptions with manufacturing capabilities, process constraints, and yield considerations.\n\nInterface with New Product Introduction (NPI) teams to support package readiness for qualification, ramp, and high-volume manufacturing.\n\nPartner withSubstrate Engineering & Technology teams to track substrate development, availability, risks, and schedule alignment.\n\nEngage withOSATs and Suppliers to support execution readiness, resolve blocking issues, and ensure manufacturability alignment.\n\nCoordinate with EDA and tooling teams to ensuredesign flows and tools are ready to support program needs.\n\nDesign, EDA & Process Enablement (Supporting / Enabling Role)\nUse existingpackage design flows, EDA tools, reference methodologies, and execution checklists to support program execution.\n\nDraft, document, and maintain process flows that clearly define execution steps, handoffs, inputs, and outputs across the package design lifecycle.\n\nDevelopclear, structured documentation describing:\nPackage design and execution workflows\n\nDesign release and handoff steps\n\nReadiness checks and acceptance criteria\n\nCommon issues, failure modes, and escalation paths\n\nTranslate complex technical activities intorepeatable, well-defined process steps that can be consistently followed across teams.\n\nSupportEDA and design-flow issue triage, coordinating with subject-matter experts and tool owners as needed.\n\nApply light scripting or automation where helpful to supportreporting, consistency checks, or process enforcement.\n\nCapturelessons learned and best practices and incorporate them into updated process documentation and workflows.\n\nRequired Skills & Experience\nProgram & Execution Skills (Core)\nExperience supportingcomplex, cross-functional engineering programs.\n\nStrong organizational skills with the ability to managemultiple workstreams in parallel.\n\nExperience usingproject / program management tools, including:\nExecution dashboards\n\nMilestone and dependency trackers\n\nGantt charts or schedule views\n\nAction-item and risk tracking tools\n\nComfortable driving execution inmatrixed organizations without direct reporting authority.\n\nStrong written and verbal communication skills.\n\nTechnical Context (Enabling)\nFamiliarity withIC package development lifecycles and execution flows.\n\nWorking knowledge of IC package design, layout, integration, or manufacturing concepts.\n\nExposure to package design or EDA tools such as:\nCadence APD / SIP\n\nCadence Innovus / Virtuoso\n\nMentor Xpedition\n\nValor and RAVEL\n\nScripting or automation experience (e.g.,Python, TCL) is a plus but not required.\n\nMinimum Qualifications:\nBachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.\nOR\nMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.\nOR\nPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.\nApplicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":7480,"description_truncated":false,"requirements":{"experience_years_min":2,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Autonomous Driving","RF & Wireless Hardware","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-10-16T15:50:00Z"}],"visa":[],"liveness":{"score":24,"band":"cold","label":"Long shot","p_open":1,"p_active":0.666,"p_room":0.36,"age_days":120,"expected_fill_days":75,"reasons":["conf:1","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-17T05:46:00Z"},"pay":null,"html_url":"https://alion.io/job/qualcomm-senior-engineer-ic-package-design","json_url":"https://alion.io/job/qualcomm-senior-engineer-ic-package-design.json","meta":{"generated_at":"2026-10-18T09:13:36Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":13718,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-19T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-senior-engineer-ic-package-design"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-senior-engineer-ic-package-design"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-senior-engineer-ic-package-design"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-senior-engineer-ic-package-design\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-senior-engineer-ic-package-design"}]}