{"id":698219,"url":"https://alion.io/job/qualcomm-server-finite-element-analysis-fea-engineer","title":"Server Structural FEA Engineer","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":70,"open_postings":1059,"ghost_share":0.25,"stale_share":0.146,"repost_share":0.449,"time_to_fill_p50_days":74,"computed_at":"2026-11-08T05:47:12Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":null,"work_mode":"remote","remote_scope":"stated_countries","remote_scope_basis":"board_field","remote_working_hours":null,"hiring_geo_confidence":"inferred","locations":["Santa Clara, United States","Bengaluru, India","Cork, Ireland","China"],"countries":["US","IN","IE","CN"],"hiring_countries":["US","CN","TW","IN","IE"],"hiring_countries_total":5,"salary":{"min":190200,"max":285400,"currency":"USD","period":"year","gross":null,"usd_annual":285400},"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"Abaqus","optional":false},{"name":"ANSYS","optional":false},{"name":"Rest-Assured","optional":true}],"status":"live","first_seen_at":"2026-06-19T00:00:00Z","employer_posted_date":"2026-10-29","last_verified_at":"2026-11-08T19:30:39Z","board_verified":true,"closed_at":null,"days_open":142,"trust":{"level":"ok","repost_count":2,"flags":["repost"],"days_open":142},"description":"Company:\nQualcomm Technologies, Inc.Job Area:\nEngineering Group, Engineering Group > Systems EngineeringGeneral Summary:\nQualcomm's Data Center team is developing high-performance, energy-efficient server solutions for data center applications. We are looking for highly talented, innovative, and collaborative individuals to contribute to cutting-edge server technology development.\nOur Mission\nWe are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you will collaborate with world-class engineers to create innovative solutions that advance performance, energy efficiency, scalability, and reliability. Our focus is on developing reference platforms based on Qualcomm Snapdragon SoCs and delivering comprehensive hardware and software solutions, reference designs, user guides, SDKs, and related enablement.\nPosition Summary\nWe are seeking a Staff / Senior Staff Server Structural FEA Engineer with deep expertise in semiconductor package mechanics, structural reliability, and advanced finite element analysis. The role focuses on structural integrity and reliability of server SoCs, spanning die- and package-level behavior through interaction with the server platform. The scope includes both soldered and socketed SoC packages and their mechanical interaction with PCBs, sockets and retention systems, cooling solutions, and thermal interface materials, including TIM1.5.\nThe ideal candidate is a recognized subject matter expert who can develop predictive methodologies, evaluate failure mechanisms, quantify design margins and uncertainty, and translate analysis into actionable package and platform design guidance. The engineer will assess structural behavior across package assembly, system integration, qualification, and operation, with emphasis on chip-package interaction (CPI), warpage, die and interconnect integrity, solder-joint reliability, and mechanically coupled thermal interface risks.\nThis senior individual contributor will work closely with package engineering, computational modeling, thermal, mechanical, electrical, manufacturing, reliability, and system/platform engineering teams to align assumptions, material properties, boundary conditions, failure criteria, and correlation approaches. The engineer will develop independent analyses where needed and partner with system-level structural FEA engineers to connect SoC/package mechanical behavior to broader platform and lifecycle assessments.\nKey Responsibilities\nDevelop and apply advanced structural and thermo-mechanical FEA methodologies for server SoCs and advanced semiconductor packages, including CPI, package assembly, warpage, stress, deformation, and structural reliability.\nEvaluate both soldered and socketed packages under package assembly, SMT, socket and retention loading, cooling-system loading, temperature cycling, qualification, and operating conditions.\nAnalyze package-to-platform mechanical interaction among the SoC package, PCB, socket or retention system, heatsink or cold plate, and thermal interface materials, including TIM1.5.\nApply advanced FEA techniques including submodeling, contact analysis, material and geometric nonlinearity, viscoelasticity, creep, fatigue, fracture or damage mechanics, and coupled structural-thermal analysis as appropriate.\nDevelop physics-based reliability and life-prediction models for relevant failure mechanisms, including solder and bump fatigue, die and BEOL stress, substrate and interposer cracking, delamination, and creep. Perform BLR and solder-joint reliability analyses to quantify damage accumulation, design margins, and expected life.\nPerform sensitivity, uncertainty, and bounding analyses to identify dominant parameters, quantify structural risk, and guide package and platform architecture decisions before hardware is available.\nDefine model-validation and correlation strategies using material characterization, package/board measurements, reliability and qualification testing, manufacturing data, and system-level test results, including development of test vehicles and methods where needed.\nPartner with package engineering and computational modeling teams to align modeling assumptions, material properties, process inputs, boundary conditions, revision control, correlation methodologies, and failure criteria.\nDevelop independent analyses, sensitivity studies, or targeted model cross-checks as needed to reconcile differing predictions, quantify uncertainty, and evaluate server-specific package-to-platform boundary conditions.\nWork closely with system/platform structural-analysis engineers to provide package mechanical properties, load limits, deformation behavior, and failure criteria supporting broader platform, system, and rack-level lifecycle analyses.\nApply expertise in package architectures and substrate technologies, including FCBGA, FCLGA/HFCBGA, chiplet-based designs, HBM integration, 2.5D interposers or bridges, and 3D packaging technologies.\nDevelop scalable workflows, automation, modeling standards, best-known methods (BKMs), and validation frameworks. Experience with ANSYS APDL-based workflow development is strongly preferred.\nTranslate complex simulation results into clear design requirements and recommendations for cross-functional engineering teams, leadership, customers, and suppliers.\nQualifications\nMaster's degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or a related field.\n10+ years of advanced FEA experience in semiconductor packaging, microelectronics assembly, CPI, structural reliability, and interconnect technologies.\nStrong foundation in structural and failure mechanics, materials science, thermo-mechanical behavior, fatigue and creep, with experience applying nonlinear FEA techniques including contact, submodeling, thermal cycling, and interconnect reliability analysis.\nDemonstrated experience modeling semiconductor-package failure mechanisms and correlating simulations with experimental, manufacturing, or qualification data.\nProficiency in ANSYS Workbench, ANSYS APDL, ABAQUS, or equivalent nonlinear FEA tools.\nProven ability to operate independently and lead in cross-functional environments, with strong technical documentation, communication, and presentation skills.\nPreferred Qualifications\nPh.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or a related field.\nDeep expertise in package mechanics, CPI, package assembly simulation, warpage prediction, die and BEOL reliability, and solder or interconnect reliability.\nDemonstrated experience with both soldered and socketed high-pin-count server packages and package interaction with PCBs, sockets, retention hardware, heatsinks or cold plates, and TIM materials.\nProven experience developing physics-based reliability models and life predictions for solder joints, bumps, die/package structures, substrates, interposers, underfill, adhesives, or related failure mechanisms.\nProven simulation-to-test correlation using warpage measurements, strain or displacement measurements, material characterization, thermal-cycling data, mechanical loading tests, or qualification results.\nExperience developing APDL automation, reusable workflows, modeling standards, and BKMs.\nExperience with coupled structural-thermal analysis and mechanical/thermal co-optimization.\nUnderstanding of server and OCP platform designs and associated assembly, handling, transportation, qualification, and operating environments.\nMinimum Qualifications:\n• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.OR\nMaster's degree in Engineering, Information Systems, Computer Science, or related field and 5+ years of Systems Engineering or related work experience.\nOR\nPhD in Engineering, Information Systems, Computer Science, or related field and 4+ years of Systems Engineering or related work experience.\nQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nEEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nPay rangeand Other Compensation & Benefits :\n$190,200.00 - $285,400.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":10846,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"},{"name":"China","iso":"CN","kind":"country"},{"name":"Taiwan","iso":"TW","kind":"country"},{"name":"India","iso":"IN","kind":"country"},{"name":"Ireland","iso":"IE","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Autonomous Driving","RF & Wireless Hardware","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-09-11T02:22:19Z"},{"event":"close","at":"2026-09-11T05:42:15Z"},{"event":"reopen","at":"2026-09-11T23:28:00Z"},{"event":"close","at":"2026-09-12T02:28:18Z"},{"event":"reopen","at":"2026-09-12T05:28:20Z"},{"event":"close","at":"2026-09-12T08:47:27Z"},{"event":"reopen","at":"2026-09-15T03:57:42Z"},{"event":"close","at":"2026-10-02T21:23:27Z"},{"event":"reopen","at":"2026-10-04T17:14:55Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 1,115 · green card filings: 76","filings_12m":1115,"filings_prev_12m":2000,"green_card_filings_12m":76,"median_offered_wage_usd":150938,"route":null,"cap_exempt":false,"checked_at":"2026-11-08T10:45:15+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":22,"band":"cold","label":"Long shot","p_open":1,"p_active":0.6,"p_room":0.36,"age_days":142,"expected_fill_days":74,"reasons":["conf:2","repost:2","velocity","win:tail","crowd:brand"],"computed_at":"2026-11-08T05:47:12Z"},"pay":{"stated_usd_annual":285400,"is_top_pay":true},"html_url":"https://alion.io/job/qualcomm-server-finite-element-analysis-fea-engineer","json_url":"https://alion.io/job/qualcomm-server-finite-element-analysis-fea-engineer.json","meta":{"generated_at":"2026-11-08T23:18:11Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":48492,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-09T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.1,"usd":0.01,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-server-finite-element-analysis-fea-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":2,"usd":0.2},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-server-finite-element-analysis-fea-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.1,"usd":0.01},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-server-finite-element-analysis-fea-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-server-finite-element-analysis-fea-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-server-finite-element-analysis-fea-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":698219}},{"tool":"search_jobs","arguments":{"company":"qualcomm.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":698219},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}