{"id":1760154,"url":"https://alion.io/job/qualcomm-sr-staff-packaging-engineer-process-package-integrity-bumping","title":"Sr. Staff Packaging Engineer- Process Package Integrity & Bumping","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"C","score":69,"open_postings":1032,"ghost_share":0.257,"stale_share":0.155,"repost_share":0.459,"time_to_fill_p50_days":74,"computed_at":"2026-11-03T05:54:40Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Diego, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":191800,"max":287800,"currency":"USD","period":"year","gross":null,"usd_annual":287800},"salary_estimate":null,"experience_years_min":8,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"FMEA","optional":false},{"name":"Rest-Assured","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-09-02T00:00:00Z","employer_posted_date":"2026-09-25","last_verified_at":"2026-11-03T05:57:36Z","board_verified":true,"closed_at":null,"days_open":62,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":62},"description":"Company:\nQualcomm Technologies, Inc.Job Area:\nEngineering Group, Engineering Group > Packaging EngineeringGeneral Summary:\nThe engineer will be a key member of the Process Package Integration and bumping process team, driving technology development and new product introduction (NPI) with primary ownership of wafer bumping (Far-BEOL) process integration, qualification, and high-volume readiness across multiple silicon technology nodes, foundries, bumping lines, and assembly houses (OSATs). Key responsibilities include defining bumping process flows (passivation/UBM/RDL/bump), establishing process windows and controls, leading DOE-based optimization, and partnering with suppliers to improve yield, reliability, and cost. The role works closely with foundry FBEOL teams, bumping/assembly partners, and internal package design, process, quality, test, and product development teams to deliver robust bumping solutions enabling advanced packaging (flip-chip, RDL/fan-out, and 2.5D/3DIC). The candidate will also lead bumping house/line bring-up, qualification, and ongoing performance management to expand capacity and ensure multi-source readiness.\nSkill/Knowledge:\nExpertise in Far-BEOL bumping process modules and integration, including passivation openings, UBM, RDL (as applicable), solder/Cu pillar bump formation, and associated materials/equipment.\nDeep knowledge of flip-chip bump design intent and assembly interactions (bump metallurgy, pitch scaling, coplanarity, warpage interactions), and wafer-level packaging (RDL) / fan-out process considerations impacting bumping.\nStrong technical skills in bumping process/material/equipment characterization (metrology and inline controls), failure analysis, DOE design, statistical data analysis, and FMEA to drive yield and reliability improvements.\nExperience leading bumping process qualification and production release activities (process window definition, control plans/SPC, GR&R, and risk mitigation) for NPI and high-volume manufacturing.\nProven track record enabling package development through robust bumping solutions for flip-chip, RDL/fan-out RDL, and advanced packaging technologies (2.5D/3DIC).\nExpertise in manufacturing execution for Far-BEOL bump structures and bump line operations, including new bumping line bring-up, tooling/equipment qualification, and production ramp (HVM readiness).\nHands-on experience in project leadership and supplier management for external bumping houses/OSATs, including KPI definition, yield excursions containment, and continuous improvement programs.\nExperienced interfacing with foundries and bumping houses on process integration, change control, line qualification, and multi-source/capacity expansion.\nUnderstanding of heterogeneous integration (2.5D/3DIC) packaging flows and how bumping/interconnect schemes (micro-bumps, fine-pitch RDL) impact downstream assembly and reliability.\nAbility to design and drive novel test vehicles/structures for bump/RDL process characterization and process-package interaction (reliability, electromigration, mechanical integrity).\nExperience with chip and substrate design tools such as Calibre, Virtuoso, CAD, SiP, and GDS.\nUnderstanding of chip-top physical design flow and communication with package design teams.\nMinimum of 8-10 years hands-on experience in silicon interconnect process, bumping and/or RDL process, new technology qualification and production.\nAdditional Skills\nGood analytical and project management skills.\nExcellent capability of innovation and creativity.\nHighly motivated and committed to success of the individual and the team.\nSuperior interpersonal communication skills. Publish technical reports.\nAble to work flexible hours. Occasional domestic/international travels needed.\nMinimum Qualifications:\n• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.OR\nMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience.\nOR\nPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ year of System/Package Design/Technology Engineering or related work experience.\nQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nEEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nPay rangeand Other Compensation & Benefits :\n$191,800.00 - $287,800.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":7181,"description_truncated":false,"requirements":{"experience_years_min":8,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Artificial Intelligence","Autonomous Driving","Energy Efficiency","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-10-03T12:24:10Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 55 · green card filings: 6","filings_12m":55,"filings_prev_12m":87,"green_card_filings_12m":6,"median_offered_wage_usd":122008,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":53,"band":"ok","label":"Likely open","p_open":1,"p_active":0.883,"p_room":0.6,"age_days":62,"expected_fill_days":74,"reasons":["conf:4","velocity","win:late","crowd:brand"],"computed_at":"2026-11-03T05:54:40Z"},"pay":{"stated_usd_annual":287800,"is_top_pay":true},"html_url":"https://alion.io/job/qualcomm-sr-staff-packaging-engineer-process-package-integrity-bumping","json_url":"https://alion.io/job/qualcomm-sr-staff-packaging-engineer-process-package-integrity-bumping.json","meta":{"generated_at":"2026-11-03T07:19:35Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":10276,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-04T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-sr-staff-packaging-engineer-process-package-integrity-bumping"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-sr-staff-packaging-engineer-process-package-integrity-bumping"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-sr-staff-packaging-engineer-process-package-integrity-bumping"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-sr-staff-packaging-engineer-process-package-integrity-bumping\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-sr-staff-packaging-engineer-process-package-integrity-bumping"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":1760154}},{"tool":"search_jobs","arguments":{"company":"qualcomm.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":1760154},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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