{"id":754953,"url":"https://alion.io/job/qualcomm-sr-staffprincipal-engineer-low-power-chip-architect-system-engineer","title":"Sr. Staff/Principal Engineer - Low Power Chip Architect / System Engineer","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":71,"open_postings":1166,"ghost_share":0.225,"stale_share":0.125,"repost_share":0.466,"time_to_fill_p50_days":75,"computed_at":"2026-10-19T05:45:15Z"}},"role":"DevOps","role_family":"DevOps","seniority":"lead","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Diego, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":200000,"max":300000,"currency":"USD","period":"year","gross":null,"usd_annual":300000},"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"Edge AI","optional":false},{"name":"MATLAB","optional":false},{"name":"Multimodal AI","optional":false},{"name":"Sensor Fusion","optional":false},{"name":"Simulink","optional":false},{"name":"Cadence Virtuoso","optional":true},{"name":"Python","optional":true},{"name":"Rest-Assured","optional":true},{"name":"Synopsys HSPICE","optional":true},{"name":"Verilog","optional":true}],"status":"live","first_seen_at":"2026-05-28T00:00:00Z","employer_posted_date":"2026-09-17","last_verified_at":"2026-10-19T22:24:46Z","board_verified":true,"closed_at":null,"days_open":145,"trust":{"level":"ghost","repost_count":3,"flags":["repost"],"days_open":144},"description":"Company:\nQualcomm Technologies, Inc.Job Area:\nEngineering Group, Engineering Group > ASICS EngineeringGeneral Summary:\nWe are seeking a senior-level Low Power Chip Architect / System Engineer with deep expertise in mixed-signal IC and system design and a proven record of chip-level technical leadership. This is a high-impact role responsible for defining the architecture, driving transistor-level design, and enabling system-level integration of ultra-low-power integrated circuits (ICs) for Robotics and Industrial IoT (IIoT) applications.\nThe successful candidate will bridge high-performance Analog Front Ends (AFEs) with digital logic and firmware, leading programs from initial architecture and specification through simulation, verification, tape-out, and early silicon bring-up. This role requires strong cross-functional collaboration, sound architectural judgment, and the ability to operate effectively in ambiguous environments.\nResponsibilities:\nArchitecture & Technical Leadership\nDefine and support end-to-end system architecture, including partitioning across analog, digital, firmware, and system domains\nDrive architectural trade-offs across power, performance, noise, latency, and silicon area\nPartner with chip leads and system leads from concept definition through silicon bring-up and validation\nMixed-Signal Design & Integration\nLead feasibility studies and transistor-level design of mixed-signal building blocks including ADCs, DACs, PLLs/DLLs, LDOs, and SerDes\nArchitect and integrate ultra-low-power AFEs optimized for battery-operated IIoT and Robotics sensor ASICs\nDrive full-chip execution in collaboration with internal teams and third-party IP vendors and design houses\nModeling, Verification & Silicon Execution\nDevelop behavioral and system-level models using MATLAB/Simulink (or equivalent tools) to evaluate noise, linearity, and SNR\nPerform comprehensive pre-silicon verification across PVT corners using industry-standard simulators\nSupport post-silicon bring-up, characterization, and reliability qualification, including HTOL and burn-in\nCollaborate with packaging, test, and system teams to ensure successful productization\nSystem & Application Enablement\nSupport multi-modal sensor data acquisition, sensor fusion, and edge AI inference workflows\nContribute to hardware-software integration for efficient system-level deployment\nMinimum Qualifications:\n• Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.OR\nMaster's degree in Science, Engineering, or related field and 7+ years of ASIC design, verification, validation, integration, or related work experience.\nOR\nPhD in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.\nPreferred Qualifications:\n Ph.D. in Electrical Engineering (or related field) with 8+ years of post-degree industrial IC/system design experience OR\n M.S. in Electrical Engineering (or related field) with 10-12+ years of industrial IC/system design experience\nStrong expertise in low-power analog and mixed-signal (AMS) IC design\nHands-on experience with Cadence Virtuoso, AMS sims, verilog and related analog design tools\nProficiency with Spectre, HSPICE, and board-level simulation methodologies\nSolid understanding of PDKs, LVS, DRC, and PEX flows\nProven experience with ESD and reliability standards (HBM, CDM, TLP)\nAdvanced academic background in Electrical Engineering or a closely related field\nExtensive industry experience in mixed-signal IC and system-level design\nDemonstrated experience as a Chip Lead, System Architect, or Technical Lead\nProven ability to drive end-to-end silicon programs from concept to production\nStrong capability to work independently and provide technical direction with minimal supervision\nExperience with digital design flows, including synthesis and timing analysis\nFamiliarity with firmware development and software integration\nWorking knowledge of embedded interfaces such as I2C, I3C, SPI, and MIPI\nProficiency in Python or similar scripting languages\nExperience with deep submicron CMOS technologies and low-power fabrication processes\nExposure to IC packaging, board-level validation, and system bring-up\nBackground in sensor systems, sensor fusion, or edge AI applications\nSoft Skills:\nStrong technical leadership and ownership mindset\nExcellent cross-functional communication and collaboration skills\nAbility to mentor and guide engineers across analog, digital, layout, and system domains\nStrong analytical and problem-solving abilities\nComfortable making architecture-level decisions under ambiguity\nEffective at managing external vendors, IP providers, and design partners\nResults-driven with a strong focus on execution and quality\n** Position requires to be onsite in San Diego, 5 days a week. **\nQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nEEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nPay rangeand Other Compensation & Benefits :\n$200,000.00 - $300,000.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":7722,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","RF & Wireless Hardware","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-09-11T16:54:35Z"},{"event":"close","at":"2026-09-11T19:54:38Z"},{"event":"reopen","at":"2026-09-13T05:40:27Z"},{"event":"close","at":"2026-09-13T08:50:22Z"},{"event":"reopen","at":"2026-09-13T11:50:26Z"},{"event":"close","at":"2026-09-13T14:50:35Z"},{"event":"reopen","at":"2026-09-13T17:50:41Z"},{"event":"close","at":"2026-09-13T20:50:48Z"},{"event":"reopen","at":"2026-09-15T13:38:16Z"},{"event":"close","at":"2026-09-17T12:54:03Z"},{"event":"reopen","at":"2026-09-23T12:18:53Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 55 · green card filings: 6","filings_12m":55,"filings_prev_12m":87,"green_card_filings_12m":6,"median_offered_wage_usd":122008,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":18}],"liveness":{"score":11,"band":"cold","label":"Long shot","p_open":1,"p_active":0.3,"p_room":0.36,"age_days":144,"expected_fill_days":75,"reasons":["conf:3","repost:3","velocity","ghost","win:tail","crowd:brand"],"computed_at":"2026-10-19T05:45:15Z"},"pay":{"stated_usd_annual":300000,"is_top_pay":true},"html_url":"https://alion.io/job/qualcomm-sr-staffprincipal-engineer-low-power-chip-architect-system-engineer","json_url":"https://alion.io/job/qualcomm-sr-staffprincipal-engineer-low-power-chip-architect-system-engineer.json","meta":{"generated_at":"2026-10-20T00:16:14Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":284,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-21T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-sr-staffprincipal-engineer-low-power-chip-architect-system-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-sr-staffprincipal-engineer-low-power-chip-architect-system-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-sr-staffprincipal-engineer-low-power-chip-architect-system-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-sr-staffprincipal-engineer-low-power-chip-architect-system-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-sr-staffprincipal-engineer-low-power-chip-architect-system-engineer"}]}