{"id":4205035,"url":"https://alion.io/job/qualcomm-staff-advanced-packaging-engineer","title":"Staff Advanced Packaging Engineer","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"C","score":69,"open_postings":1007,"ghost_share":0.259,"stale_share":0.144,"repost_share":0.455,"time_to_fill_p50_days":74,"computed_at":"2026-11-12T10:38:37Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Diego, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":160200,"max":240200,"currency":"USD","period":"year","gross":null,"usd_annual":240200},"salary_estimate":null,"experience_years_min":8,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"Rest-Assured","optional":true}],"status":"live","first_seen_at":"2026-10-23T00:00:00Z","employer_posted_date":"2026-11-12","last_verified_at":"2026-11-12T23:19:29Z","board_verified":true,"closed_at":null,"days_open":21,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":21},"description":"Company:\nQualcomm Technologies, Inc.Job Area:\nEngineering Group, Engineering Group > Packaging EngineeringGeneral Summary:\nWe are seeking a highly motivated Staff Engineer, Advanced Packaging & Package Integration to lead package technology development, architecture, NPI, and manufacturing execution for next-generation AI and data center products. The role will focus on advanced heterogeneous integration and close collaboration with foundries, OSATs, substrate suppliers, and internal design and manufacturing teams.\nKey Responsibilities\nAdvanced Package Development & Integration\nLead package development for 2.5D/3D integration, CoWoS, SoIC, HBM, Silicon Bridge, hybrid bonding, FCBGA, and high-density substrates.\nDrive package architecture optimization, including die floorplanning, bump/microbump strategy, power/signal integrity, and thermal/mechanical design.\nDevelop package test vehicles to support technology qualification and early risk reduction.\nNPI & Manufacturing\nLead package NPI from concept through engineering builds, qualification, production ramp, and manufacturing release.\nDrive bumping, flip-chip assembly, underfill, thermal solutions, substrate assembly, and board-level integration.\nLead technical risk assessment, root-cause analysis, qualification, yield improvement, and manufacturing readiness.\nFoundry & Supplier Collaboration\nPartner with foundries, bumping houses, substrate suppliers, and OSATs on design rules, PDK readiness, process capability, reliability, yield, cycle time, capacity, and production ramp.\nSupport new process and production-line qualification and multi-source readiness.\nAdditional Skills\nGood analytical and project management skills.\nExcellent capability of innovation and creativity.\nHighly motivated and committed to success of the individual and the team.\nSuperior interpersonal communication skills. Publish technical reports.\nAble to work flexible hours. Occasional domestic/international travels needed.\nMinimum Qualifications:\n• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.OR\nMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.\nOR\nPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.\nPreferred Qualifications:\nM.S. or Ph.D. in Materials Science, Mechanical engineering, chemical engineering or equivalent.\nMinimum of 8-10 years hands-on experience in silicon interconnect process, bumping and/or RDL process, new technology qualification and production.\nQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nEEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nPay rangeand Other Compensation & Benefits :\n$160,200.00 - $240,200.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":5665,"description_truncated":false,"requirements":{"experience_years_min":8,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Autonomous Driving","RF & Wireless Hardware","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-11-12T23:19:29Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 1,115 · green card filings: 76","filings_12m":1115,"filings_prev_12m":2000,"green_card_filings_12m":76,"median_offered_wage_usd":150938,"route":null,"cap_exempt":false,"checked_at":"2026-11-12T07:36:15+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":620}],"liveness":{"score":86,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.86,"p_room":1,"age_days":21,"expected_fill_days":74,"reasons":["conf:1","win:early","comp:brand"],"computed_at":"2026-11-13T00:41:44Z"},"pay":{"stated_usd_annual":240200,"is_top_pay":true},"html_url":"https://alion.io/job/qualcomm-staff-advanced-packaging-engineer","json_url":"https://alion.io/job/qualcomm-staff-advanced-packaging-engineer.json","meta":{"generated_at":"2026-11-13T00:41:44Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":1533,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-14T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.1,"usd":0.01,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-staff-advanced-packaging-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"free","price":{"credits":0,"usd":0},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-staff-advanced-packaging-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.1,"usd":0.01},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-staff-advanced-packaging-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-staff-advanced-packaging-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-staff-advanced-packaging-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":4205035}},{"tool":"search_jobs","arguments":{"company":"qualcomm.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":4205035},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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