{"id":1934228,"url":"https://alion.io/job/qualcomm-staff-engineer-thermal","title":"Staff Engineer, Thermal","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":73,"open_postings":1253,"ghost_share":0.211,"stale_share":0.106,"repost_share":0.472,"time_to_fill_p50_days":74,"computed_at":"2026-10-12T06:55:09Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Diego, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":160200,"max":240200,"currency":"USD","period":"year","gross":null,"usd_annual":240200},"salary_estimate":null,"experience_years_min":6,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"C++","optional":true},{"name":"MATLAB","optional":true},{"name":"Python","optional":true},{"name":"Rest-Assured","optional":true}],"status":"live","first_seen_at":"2026-10-05T22:55:34Z","employer_posted_date":"2026-10-05","last_verified_at":"2026-10-12T22:09:46Z","board_verified":true,"closed_at":null,"days_open":7,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":7},"description":"Company:\nQualcomm Technologies, Inc.Job Area:\nEngineering Group, Engineering Group > Packaging EngineeringGeneral Summary:\nQualcomm is driving the next generation of AI computing, delivering breakthrough technologies that power intelligent experiences from edge devices to the data center.\nOur Hardware Systems organization is seeking a Principal Thermal Engineer to solve complex thermal challenges and enable industry-leading performance, efficiency, and reliability across the Qualcomm Dragonfly™ AI300 platform and future AI computing platforms. This position offers the opportunity to work on cutting-edge thermal architecture, simulation, validation, and optimization challenges, helping bring innovative AI products from concept through production while collaborating with world-class experts across silicon, packaging, hardware, and system engineering teams.\nKey Responsibilities:\nLead thermal architecture solutions through simulation and test while working with various stakeholders.\nPerform thermal simulations utilizing CFD tools from silicon to data center environment throughout product development phase.\nDrive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations.\nConduct thermal tests to validate/characterize models and present results to stakeholders.\nAnalyze and document simulation and test results.\nMinimum Qualifications:\n• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.OR\nMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.\nOR\nPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.\nPreferred Qualifications:\n6+ years of industry experience in electronics cooling, with a strong focus on high-performance computing, AI, or data center products.\nExperience developing thermal solutions for high-power processors, GPUs, AI accelerators, or advanced compute platforms utilizing air, liquid, or hybrid cooling technologies\nDeep understanding of thermal management technologies and design elements, including thermal interface materials (TIMs), heat spreaders, heat sinks, vapor chambers, heat pipes, and forced-air cooling solutions.\nExperience with advanced semiconductor packaging technologies, including 2.5D and 3D package architectures; exposure to high-power AI accelerator packaging is highly desirable.\nProficiency in scripting and programming for data analysis, model automation, and tool development using languages such as Python, C/C++, MATLAB, or equivalent.\nStrong expertise in computational fluid dynamics (CFD) analysis, with hands-on experience using industry-standard tools such as ANSYS Icepak, Celsius EC, Flotherm, or similar platforms.\nDemonstrated ability to design, execute, and analyze thermal validation experiments in a laboratory environment, including hands-on use of airflow, temperature, power, and data-acquisition instrumentation.\nExperience correlating simulation models with empirical test results and driving model accuracy improvements throughout the product development lifecycle.\nExcellent communication, presentation, and cross-functional collaboration skills, with the ability to influence technical decisions across diverse engineering teams.\nAbility to clearly communicate complex technical concepts, analyses, and recommendations to both technical and non-technical audiences.\nFamiliarity with AI/ML workloads, accelerator architectures, and associated thermal challenges is a plus\nQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nEEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nPay rangeand Other Compensation & Benefits :\n$160,200.00 - $240,200.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":6674,"description_truncated":false,"requirements":{"experience_years_min":6,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Artificial Intelligence","Autonomous Driving","Energy Efficiency","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-10-05T22:55:34Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 55 · green card filings: 6","filings_12m":55,"filings_prev_12m":87,"green_card_filings_12m":6,"median_offered_wage_usd":122008,"route":null,"cap_exempt":false,"checked_at":"2026-10-03T21:08:04+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":6,"expected_fill_days":74,"reasons":["conf:1","velocity","win:early","comp:brand"],"computed_at":"2026-10-12T06:55:09Z"},"pay":{"stated_usd_annual":240200,"is_top_pay":true},"html_url":"https://alion.io/job/qualcomm-staff-engineer-thermal","json_url":"https://alion.io/job/qualcomm-staff-engineer-thermal.json","meta":{"generated_at":"2026-10-13T00:29:38Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":794,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-14T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-staff-engineer-thermal"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-staff-engineer-thermal"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-staff-engineer-thermal"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-staff-engineer-thermal\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-staff-engineer-thermal"}]}