{"id":669130,"url":"https://alion.io/job/qualcomm-taiwanapac-digital-soc-test-engineer-integrationstructuralatpgscanmbist","title":"【Taiwan】APAC Digital SOC Test Engineer-Integration/Structural/ATPG/SCAN/MBIST","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":71,"open_postings":1169,"ghost_share":0.224,"stale_share":0.125,"repost_share":0.465,"time_to_fill_p50_days":75,"computed_at":"2026-10-20T05:45:00Z"}},"role":"QA","role_family":"QA","seniority":"middle","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":4,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"C++","optional":true},{"name":"Git","optional":true},{"name":"Java","optional":true},{"name":"Python","optional":true},{"name":"Rest-Assured","optional":true}],"status":"live","first_seen_at":"2026-04-17T00:00:00Z","employer_posted_date":"2026-04-17","last_verified_at":"2026-10-20T05:48:38Z","board_verified":true,"closed_at":null,"days_open":186,"trust":{"level":"ghost","repost_count":3,"flags":["repost"],"days_open":186},"description":"Company:\nQualcomm Semiconductor LimitedJob Area:\nEngineering Group, Engineering Group > Hardware Engineering General Summary:\nAs a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all.\nProduct and Test Development Engineering (PDTE) is looking for Digital Test Engineers who will create test solutions in support of New Product Introduction (Silicon Validation and Characterization) and Manufacturing Enablement of Qualcomm Silicon on Chip (SOC) products.\nThis role emphasizes hands-on ownership of structural test content (Test program integration, Processors, DDR, and Sensors, DC, Structural ATPG Testing), with opportunities to work across functional, high-speed, and characterization testing. The position focuses on debugging test issues, improving test efficiency, and enabling robust, scalable test solutions, particularly on advanced technology nodes.\nYou will work closely with DFT, Design, Yield, Reliability, Product, and Test Engineering teams, contributing to issue resolution, data-driven decisions, and continuous improvement of test quality and cost.\nKey Responsibilities\nDevelop, bring up, and validate SoC | Chiplet test programs across NPI and high-volume manufacturing stages.\n\nDebug and resolve issues related to coverage, test time, yield, and test escapes.\n\nImprove test efficiency and cost, including test time optimization and test flow simplification.\n\nAnalyze test and yield data to identify trends, root causes, and improvement opportunities.\n\nCollaborate cross-functionally with DFT, Design, Yield, Reliability, Product, and Manufacturing Test Engineers.\n\nParticipate in cross-region collaboration, driving timely issue resolution across global teams.\n\nCommunicate technical findings clearly to peers and stakeholders, with appropriate level of detail.\n\nMinimum Qualifications\nBachelor’s or Master’s degree in Electrical / Electronic Engineering, Computer Engineering, or a related field.\n\nFor senior level, nice to have 4+ years of Test Engineering experience, with hands-on involvement in SoC test program bring-up.\n\nExperience in one or more of the following test areas:\nStructural test (ATPG, TDF, MBIST)\n\nFunctional test\n\nHigh-speed test\n\nTest-related characterization\n\nHigh-voltage stress\n\nIntegration\n\nExperience in one or more chiplet-based or multi-die products, including die-to-die (D2D) interfaces and associated test and yield challenges.\n\nHands-on experience with Advantest 93K or Teradyne UltraFLEX / iFlex test platforms.\n\nProficiency in one or more programming or scripting languages (C++, VB, Java, Python).\n\nExperience using test or yield data analysis tools (e.g., O+, Data Power, Exensio).\n\nExposure to test method or test library development, including development, validation, regression, and enhancements.\n\nPreferred Qualifications\nExperience working on System-on-Chip (SoC) | Chiplet products.\n\nExperience defining or executing chiplet test strategies, including:\nD2D interface coverage\n\nMulti-stage test flows\n\nYield issue root-causing and resolution\n\nCollaboration with DFT, Design, Process, and Package Design teams\n\nExperience supporting test bring-up or debug on advanced or leading-edge technology nodes.\n\nExperience using data analysis tools such as O+, Exensio, JMP, or similar platforms.\n\nExperience mentoring or supporting junior engineers in a collaborative engineering environment.\n\nInterest or experience in AI-assisted tools for test automation, workflow efficiency, or engineering data analysis.\n\nHands-on experience with version control systems (Git or SVN).\n\nFamiliarity with issue tracking systems such as JIRA.\n\nComfortable communicating in English, including participation in technical discussions and cross-region collaboration.\n\nMinimum Qualifications:\n• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.\nIf you would like more information about this role, please contact Qualcomm Careers.","description_format":"text","description_chars":5779,"description_truncated":false,"requirements":{"experience_years_min":4,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Upper-Intermediate (B2)","optional":true}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Incident Response","Processors, MCUs & AI Chips","RF & Wireless Hardware","Car Electronics"],"lifecycle":[{"event":"open","at":"2026-09-10T22:14:10Z"},{"event":"close","at":"2026-09-11T02:22:19Z"},{"event":"reopen","at":"2026-09-11T05:42:15Z"},{"event":"close","at":"2026-09-11T12:35:39Z"},{"event":"reopen","at":"2026-09-13T11:50:26Z"},{"event":"close","at":"2026-09-13T17:50:41Z"},{"event":"reopen","at":"2026-09-14T18:51:07Z"},{"event":"close","at":"2026-09-15T03:57:42Z"},{"event":"reopen","at":"2026-09-17T07:43:41Z"}],"visa":[],"liveness":{"score":7,"band":"cold","label":"Long shot","p_open":1,"p_active":0.241,"p_room":0.28,"age_days":186,"expected_fill_days":75,"reasons":["conf:3","repost:3","velocity","ghost","win:tail","crowd:brand"],"computed_at":"2026-10-20T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/qualcomm-taiwanapac-digital-soc-test-engineer-integrationstructuralatpgscanmbist","json_url":"https://alion.io/job/qualcomm-taiwanapac-digital-soc-test-engineer-integrationstructuralatpgscanmbist.json","meta":{"generated_at":"2026-10-20T06:42:50Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":7390,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-21T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":94},"rest":"https://alion.io/mcp/rest/get_company?id=94"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fqualcomm-taiwanapac-digital-soc-test-engineer-integrationstructuralatpgscanmbist"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fqualcomm-taiwanapac-digital-soc-test-engineer-integrationstructuralatpgscanmbist"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fqualcomm-taiwanapac-digital-soc-test-engineer-integrationstructuralatpgscanmbist"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/qualcomm-taiwanapac-digital-soc-test-engineer-integrationstructuralatpgscanmbist\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fqualcomm-taiwanapac-digital-soc-test-engineer-integrationstructuralatpgscanmbist"}]}