{"id":863710,"url":"https://alion.io/job/qualcomm-thermal-engineer-staff","title":"Thermal Engineer, Staff","company":{"id":94,"name":"Qualcomm","domain":"qualcomm.com","url":"https://alion.io/company/qualcomm","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"C","score":69,"open_postings":1068,"ghost_share":0.255,"stale_share":0.147,"repost_share":0.45,"time_to_fill_p50_days":74,"computed_at":"2026-11-06T05:58:05Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":28000,"max_usd":65000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1702},"experience_years_min":8,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"ANSYS","optional":false},{"name":"C++","optional":false},{"name":"Python","optional":false},{"name":"Rest-Assured","optional":true},{"name":"SolidWorks","optional":true}],"status":"live","first_seen_at":"2026-08-12T00:00:00Z","employer_posted_date":"2026-08-20","last_verified_at":"2026-11-06T07:53:20Z","board_verified":true,"closed_at":null,"days_open":86,"trust":{"level":"ok","repost_count":0,"flags":[],"days_open":86},"description":"Company:\nQualcomm Semiconductor LimitedJob Area:\nEngineering Group, Engineering Group > Packaging EngineeringGeneral Summary:\nQualcomm’s Hardware Systems organization is seeking a seasoned Thermal Engineer to join our Taiwan team. The qualified individual will be creating innovative solutions resolving complex thermal management challenges supporting data center AI applications, and will apply analytical and empirical skills on the development of advanced thermal architecture solutions for high performance packages utilized in data center applications.\nResponsibilities\nPerform package and system-level thermal modeling to maximize thermal performance of various packages.\n\nDesign, set up, run, and deliver results for various thermal experiments to validate performance of hardware.\n\nManage technical projects and collaborate with other internal organizations and OEMs/ODMs to support the execution process throughout development cycle.\n\nPerform thermal simulations and tests and prepare and present results to stakeholders from various disciplines.\n\nSkills and Experience\n8+ years of industry experience in electronics cooling preferably related to data center packages and systems.\n\nExpertise in conducting CFD simulations utilizing tools such as ANSYS-Icepak, Flotherm, or Celsius-EC.\n\nSkillset and hands-on experience to enable test hardware/platforms and execute test vectors for the purpose of thermal validation and verification testing.\n\nAbility to write scripts and data analysis. Programming experience with Python, C/C++.\n\nDebugging and bring up experience, in addition to operating data acquisition equipment required.\n\nAbility to design thermal tests and execute per plan within a laboratory environment.\n\nMust have experience with selection of thermal management materials.\n\nIn-depth understanding of forced convection and liquid cooling. Exposure to cooling systems related to data center industry is a plus.\n\nMust have thermal design experience with PCBs, enclosures, and heat sinks.\n\nSome experience with 3D geometry CAD tools such as Solidworks or Creo.\n\nExcellent presentation, negotiation, and communication skills.\n\nEducation Requirements\nMSME or PhD in Mechanical Engineering\n\nKeywords\nAI, data center,3DIC packages, heat transfer, CFD, ANSYS-Icepak, Flotherm, Celsius-EC, thermal management, thermal test, fans, natural convection, forced convection, radiation, conduction, liquid cooling.\nMinimum Qualifications:\n• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.OR\nMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.\nOR\nPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.\nApplicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).\nQualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.\nTo all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. 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