【Welcome New Grads】Package/System Design Solutions Engineer - Engineer / Sr. Engineer

Company:

Job Area:

General Summary:

The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc...).

Job responsibilities for this position include package selection, package design, and package electrical modeling. This involves optimizing system co-design of IC-PKG-PCB die with keeping in mind package footprint/height constraints, IC floor-planning, PCB, signal integrity, power distribution network, and thermal constraints.

Additional responsibilities:

• IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignment

• System level co-design methodology of IC, Package and PCB/Board

• Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost

• Package design flow methodology implementing high speed interface SI constraints for impedance, IR drop, cross-talk.

• Package design flow methodology implementing power distribution network (PDN) constraints for high frequency processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels

• Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products

Minimum Qualifications

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

• 3+ years Hardware Engineering experience or related work experience.

Preferred Qualifications

• Experience in IC package and/or PCB selection, design, and layout experience - Experience in Pinmap optimization of optimal PCB design

• Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory

• Working knowledge of die floor planning, IO placement, and bump placement

• Working knowledge of Chip, Package and PCB co-design methodology

• Familiar with assembly and substrate manufacturing process

• Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.

• Familiar with PCB stack-up and breakout strategy

Educational Requirements

• Bachelor's Electrical Engineering and/or Mechanical Engineering

• Preferred: Master's, Electrical Engineering

Minimum Qualifications:

OR

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.

OR

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

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