{"id":1379716,"url":"https://alion.io/job/quandela-photonic-packaging-engineer","title":"Photonic Packaging Engineer","company":{"id":704,"name":"Quandela","domain":"quandela.com","url":"https://alion.io/company/quandela","size_band":"51-200","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workable","truth_index":{"grade":"A","score":98,"open_postings":9,"ghost_share":0,"stale_share":0,"repost_share":0.111,"time_to_fill_p50_days":44,"computed_at":"2026-10-21T05:46:15Z"}},"role":"Semiconductors","role_family":"Semiconductors","seniority":null,"employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Massy, France"],"countries":["FR"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":39000,"max_usd":69000,"period":"year","method":"role_country_seniority_unknown","sample_n":183},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-28T07:47:42Z","employer_posted_date":"2026-09-28","last_verified_at":"2026-10-21T18:18:20Z","board_verified":true,"closed_at":null,"days_open":23,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":23},"description":"About Quandela\nQuandela is a global leader in photonic quantum computing, developing hardware and software technologies to build scalable and energy-efficient quantum systems.\nWith more than 140 people, we develop our own stack, from semiconductor quantum emitters and photonic integrated circuits to quantum control systems, software and algorithms.\nOur ambition is to build large-scale fault-tolerant quantum computers. Reaching this scale requires increasingly reliable, manufacturable and integrated photonic hardware, making our Integrated Photonics team a key part of this journey.\nAbout this position:\nYou will join our Integrated Photonics team, working across Massy and Palaiseau at the interface between PIC design, characterization, packaging and system integration.\nWe are looking for a hands-on Photonic Packaging Engineer to take ownership of our packaging activities, improve existing processes and help make our PIC integration more reliable and reproducible.\nYour first priority will be to contribute to ongoing packaging activities, develop and improve assembly processes, and troubleshoot integration challenges alongside our PIC design and characterization teams.\nAs you grow into the role, you will also have the opportunity to develop new packaging approaches, coordinate technical projects and contribute to building more structured and scalable packaging capabilities.\nWhy this role matters:\nToday, packaging activities involve several members of our team. Having a dedicated engineer will help us accelerate ongoing developments, improve the reproducibility of our processes and strengthen the connection between PIC design, characterization and system integration.\nAs our PIC platforms evolve, your work will also contribute to developing new integration approaches and preparing our packaging processes for future scale-up.\nRequirements\nWhat will you do:\nDevelop and improve photonic packaging processes:\nTake ownership of ongoing packaging activities and improve existing processes.\nDevelop optical coupling, precision alignment and fiber-array attachment methods.\nWork on component assembly, bonding and electrical interconnections.\nAddress mechanical and thermal integration challenges.\nTest new approaches, troubleshoot issues and improve process reproducibility.\nQualify and improve packaged devices:\nBuild and test prototypes to validate packaging approaches.\nDefine performance metrics, tolerances and acceptance criteria.\nCharacterize packaged PICs alongside the PIC Characterization team.\nTroubleshoot optical, electrical and mechanical integration issues.\nEstablish repeatable procedures and technical documentation.\nConnect packaging with PIC design:\nWork closely with PIC Designers to anticipate packaging constraints.\nTranslate assembly challenges into practical design-for-packaging guidelines.\nCollaborate with characterization and system-integration teams to improve packaged device performance.\nBuild the packaging capability:\nCollaborate with external packaging partners and equipment suppliers.\nImprove existing equipment, assembly methods and internal capabilities.\nExplore new packaging technologies and integration approaches.\nSupport automation to improve accuracy, reproducibility and throughput.\nProgressively lead technical projects and contribute to future scale-up.\nHow you'll grow:\n0-3 months → Get familiar with our PIC platforms, existing packaging processes and integration challenges. Contribute to ongoing activities and start taking ownership of selected technical tasks.\n3-6 months → Take increasing responsibility for packaging processes, develop and test improvements, and contribute to making our assembly methods more reliable and reproducible.\n6-12 months → Lead packaging development activities within your area of expertise, strengthen our qualification and documentation practices, and contribute to new packaging approaches and technical projects.\nLonger term → Depending on your experience and interests, grow into a broader technical role, leading packaging projects, strengthening external partnerships and helping shape our future packaging capabilities.\n--\nWhat we're looking for:\nMust-have:\nMaster's or PhD in Photonics, Physics, Engineering, Microelectronics or related fields.\nHands-on experience in photonic, optoelectronic or semiconductor packaging.\nPractical experience in optical alignment, component assembly or related processes.\nGood understanding of packaging tolerances, process development and qualification.\nAbility to troubleshoot integration issues and develop reliable packaging solutions.\nProfessional English.\nImportant, but you can grow here\nFiber-array / FAU attachment and fiber-to-chip coupling\nWire bonding, flip-chip integration or other electrical interconnection techniques.\nDesign for packaging, assembly and manufacturability\nMechanical and thermal integration\nExperience working with external packaging suppliers or technology partners\nAutomation of packaging or precision-assembly processes\nBonus\nPackaging of integrated photonic devices\nExperience with active photonic or optoelectronic components.\nCryogenic packaging\nHigh-density electrical interconnection\nSemiconductor production, process-engineering or NPI experience\nExperience developping packaging equipment\nPrevious experience coordinating technical projects or leading packaging development activities.\n> You do not need previous experience in quantum computing.\n> What matters most is your ability to work hands-on with packaging processes, understand integration challenges and help us develop reliable and reproducible solutions.\nBenefits\nJoin a growing quantum hardware company and contribute directly to the development of next-generation photonic quantum processors.\nTake ownership of key PIC packaging activities and processes.\nDevelop reliable and reproducible packaging solutions.\nGrow your expertise and contribute to future packaging developments.\nCollaborate with PIC design, characterization and integration teams.\nWork across photonics, semiconductor packaging and quantum hardware.\n-\nCompetitive compensation aligned with your experience and level of responsibility\nCompany savings plan\n100% health coverage (Alan)\nTransport reimbursement or mobility bonus\nSwile meal vouchers\nAccess to Gymlib\nIf your background is slightly different from what is described above but you bring strong hands-on experience in photonic, optoelectronic or semiconductor packaging, we still encourage you to apply.","description_format":"text","description_chars":6478,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Quantum Science & Computing","Quantum Computing Hardware"],"lifecycle":[{"event":"open","at":"2026-09-28T07:47:42Z"}],"visa":[],"liveness":{"score":73,"band":"hot","label":"Hiring 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