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Salary
≈ $13k – $33k per year (Estimated)
Location
Hybrid (Chennai, India)
Seniority
Senior · 7+ years exp
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 14, 2026. First seen by Alion on Sep 8, 2026.

Overview
Company
Impact
Profile match
RADWIN is an Israeli maker of point to point and point to multipoint wireless broadband systems. Its radios deliver connectivity for rural broadband, mining, transport and municipal networks where fibre is unavailable. The company sells through integrators and operators in more than a hundred countries.

Description

WIFI Tech Lead Engineer

Role Summary:

RADWIN is seeking passionate Firmware Tech Lead Engineer with 7+ years of experience in developing Wi-Fi firmware. The role involves working on embedded software development for Wi-Fi 6/7 chipsets, focusing on Upper MAC/Lower MAC, Data and Control Paths, and performance optimization within RTOS environments. You will be part of the new RADWIN Firmware Innovation Center in Chennai contributing to high performance wireless solutions.

Key Responsibilities: Design, implement, and maintain Wi-Fi firmware modules related to:

·Data Path and Control Path

·Upper MAC/Lower MAC/PHY integration

·Wi-Fi 6 and Wi-Fi 7 protocol enhancements

·Debug critical firmware issues impacting performance, stability, and throughput.

·Collaborate with hardware, RF, and systems teams to ensure optimal firmware operation across layers.

·Develop and optimize firmware for real-time embedded environments, ensuring compliance with timing constraints and system KPIs.

·Participate in code reviews, bring-up, and delivery of firmware to production hardware.

·Support regulatory (FCC, ETSI etc.,) and feature compliance (e.g., DFS, CCA, Spectral Scan, etc.).

Why Join RADWIN?

·Be part of a Firmware Innovation Group under experienced leadership.

·Work on next-generation wireless technologies with cross-functional teams in a global environment.

·Work on bleeding-edge platforms and direct engagement with chipset vendors.

·A growth-oriented, fast-paced R&D culture where firmware leads the product innovation

Requirements:

·Over 7 years of embedded software development focused on Wi-Fi firmware

·Strong knowledge of IEEE 802.11 protocols, especially Wi-Fi 6 and Wi-Fi 7 (MAC/PHY level)

·Experience in real-time embedded systems and RTOS environments

·Solid debugging skills for firmware bottlenecks, stability issues, and low-level Wi-Fi/Cellular stack problems.

·Hands-on experience with Qualcomm and/or Broadcom or MediaTek or Intel (or any other chipsets)

·Experience with Debugging tools: Wireshark, GDB, iperf, Sniffer

Requirements

·Over 7 years of embedded software development focused on Wi-Fi firmware

·Strong knowledge of IEEE 802.11 protocols, especially Wi-Fi 6 and Wi-Fi 7 (MAC/PHY level)

·Experience in real-time embedded systems and RTOS environments

·Solid debugging skills for firmware bottlenecks, stability issues, and low-level Wi-Fi/Cellular stack problems.

·Hands-on experience with Qualcomm and/or Broadcom or MediaTek or Intel (or any other chipsets)

·Experience with Debugging tools: Wireshark, GDB, iperf, Sniffer

Advantage:

·Experience with Qualcomm Wifi chipsets

·Basic experience in host-side driver development (cfg80211/nl80211, netlink communication).

·Familiarity with Linux wireless applications (e.g., hostapd, wpa_supplicant).

·Knowledge of OpenWRT, Yocto, QSDK, and user-space tools for embedded Wi-Fi platforms.

·Know how about TDD/TDMA, FDD/FDMA

·Basic understanding of bootloaders, BSP bring-up, and U-Boot configuration.

·Familiarity with RF-related features such as:

o DFS

o Spectral Scan

o Transmit power and channel calibration

·Exposure to RF equipment (e.g., spectrum analyzer) and calibration procedures.

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