{"id":3676027,"url":"https://alion.io/job/renesas-electronics-engineer-front-assembly-line","title":"Engineer (Front Assembly Line)","company":{"id":3481,"name":"Renesas Electronics","domain":"renesas.com","url":"https://alion.io/company/renesas-electronics","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SmartRecruiters","truth_index":{"grade":"B","score":75,"open_postings":116,"ghost_share":0,"stale_share":0.983,"repost_share":0,"time_to_fill_p50_days":31,"computed_at":"2026-11-04T06:34:25Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Telok Panglima Garang, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Agile","optional":false},{"name":"FMEA","optional":false},{"name":"Microsoft Excel","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-11-03T08:20:55Z","employer_posted_date":"2026-11-03","last_verified_at":"2026-11-04T16:19:55Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":1},"description":"Job Summary\nTo develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering multiple assembly processes from wafer preparation to final assembly cleaning. The role is responsible for process development, optimization, qualification, technical problem-solving, and manufacturing readiness to ensure new products meet quality, reliability, productivity, and cost requirements.\nThe engineer will work closely with NPI project management, Production, Process Engineering, Equipment Engineering, Quality Assurance, Product Engineering, Material Engineering, and other cross-functional teams to ensure successful product introduction and smooth transfer to mass production.\nKey Responsibilities\nA. NPI Process Development and Qualification\nDevelop, establish, and optimize assembly process conditions for new products.\nPrepare and execute process development plans, engineering & qualification builds, and process validation activities.\nEstablish process parameters, specifications, control limits, and acceptance criteria.\nEvaluate process feasibility, identify potential manufacturing risks, and implement preventive actions before mass production.\nReview process capability, yield performance, defect trends, and qualification results.\nPrepare technical reports, process documentation, and qualification summaries.\nSupport safe launch activities and ensure all critical process issues are resolved before mass production release.\nB. Multi-Process Engineering Responsibilities\nWafer Mounting - Develop and optimize wafer mounting processes for Normal and Taiko wafers\nWafer Dicing - Develop and optimize dicing parameters, including blade selection and other related parameters\nSolder Printing - Frame/Die - Develop and optimize solder printing processes for LF’s or designated frame substrates and on die according to the design and process flow.\nDie Bonding - Develop and optimize die bonding processes applicable process parameters.\nClip Bonding - Develop and optimize clip bonding process, clip alignment, and other applicable process parameters..\nVacuum Reflow - Develop and optimize vacuum reflow profiles.\nFlux Cleaning - Develop and optimize Flux cleaning process\nC. Cross-Functional Collaboration\nCollaborate with Production, Equipment Eng, QA, Product Eng, Material Eng, and other relevant departments\nWork with equipment and material suppliers to evaluate new technologies and improvement opportunities.\nProvide technical support during engineering builds, qualification builds, troubleshooting, and production ramp-up.\nCoordinate process readiness, material availability, and documentation before qualification and mass production.\nD. Documentation and Mass Production Transfer\nPrepare and maintain process specifications, SOPs, work instructions, process flow documents, and risk assessments.\nMaintain engineering records, process parameter histories, DOE results, and qualification reports.\nSupport PFMEA reviews and implementation of appropriate process controls.\nDefine critical-to-quality parameters and monitoring requirements.\n Bachelor's Degree in Engineering (Electrical, Electronics, E&E, Mechanical, Mechatronics, Materials, Semiconductor, or related disciplines).\nMinimum 5 years experience in semiconductor assembly, packaging, or manufacturing engineering is preferred.\nCandidates with relevant experience in multiple assembly processes, particularly power semiconductor or power discrete packaging, will have an added advantage.\nSkills and Knowledge\nStrong analytical, troubleshooting, and problem-solving skills.\nGood understanding of semiconductor assembly processes and process interactions.\nKnowledge of DOE, SPC, process capability analysis, FMEA, and structured root cause analysis.\nAbility to interpret engineering data, identify process risks, and implement effective corrective actions.\nProficiency in Microsoft Excel and PowerPoint for data analysis, technical reporting, and presentation.\nGood communication and cross-functional collaboration skills.\nAbility to manage multiple NPI activities and meet project milestones.\nAdded Advantages\nExperience in MOSFET, power discrete, or power semiconductor package assembly.\nHands-on experience in Taiko wafer handling, wafer dicing, solder printing, die bonding, clip bonding, vacuum reflow, and flux cleaning.\nExperience in solder joint inspection, void analysis, X-ray inspection, cross-section analysis, and package failure analysis.\nExperience in new product qualification, process transfer, safe launch, and mass production ramp-up.\nExperience in process development using DOE and optimization of multi-step assembly processes.\nExpected Outcomes\nSuccessful completion of NPI builds and qualification milestones according to the project schedule.\nAchievement of product yield and quality targets during engineering builds and production ramp-up.\nTimely closure of critical process issues and implementation of effective corrective actions.\nProcess capability, stability, and repeatability for critical assembly operations.\nReduction of process-related defects, material wastage, and manufacturing cost.\nCompletion of process documentation, risk assessments, and mass production handover on schedule.\n Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.\nAt Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.\nWe believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.\nAre you ready to join our team and shape the future with us?\nRenesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. 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