{"id":72032,"url":"https://alion.io/job/renesas-electronics-package-design-engineering-director","title":"Package Design Engineering - Director","company":{"id":3481,"name":"Renesas Electronics","domain":"renesas.com","url":"https://alion.io/company/renesas-electronics","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SmartRecruiters","truth_index":{"grade":"B","score":75,"open_postings":104,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":32,"computed_at":"2026-10-17T05:46:00Z"}},"role":"Leadership","role_family":"Leadership","seniority":"head","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Shah Alam, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":27000,"max_usd":61000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":3645},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Agile","optional":true}],"status":"live","first_seen_at":"2026-08-10T14:39:56Z","employer_posted_date":"2026-08-10","last_verified_at":"2026-10-18T14:18:29Z","board_verified":true,"closed_at":null,"days_open":69,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":69},"description":"We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This leader will oversee yield performance, process stability, quality control, process change management, and manufacturing readiness while partnering closely with Package Engineering, R&D, Product Engineering, Quality, Supply Chain, and external OSAT partners to successfully transition New Product Introduction (NPI) programs into scalable high-volume manufacturing (HVM).\nThe ideal candidate combines deep semiconductor packaging assembly expertise with strong operational leadership, data-driven decision-making, and cross-functional collaboration skills to drive manufacturing excellence, product quality, and continuous improvement across global operations. This role also serves as a critical interface to Director, Package Engineering by ensuring package development intent, qualification requirements, process windows, and ramp readiness are translated effectively into stable, cost-competitive, high-volume manufacturing execution.\nKey Responsibilities\nManufacturing & Sustaining Engineering Leadership\nLead sustaining engineering across semiconductor package assembly technologies and product lines.\nDrive high-volume manufacturing performance in yield, cycle time, quality, throughput, and cost.\nEstablish strong engineering systems for process control, defect reduction, and continuous improvement.\nAlign assembly engineering roadmaps with business growth and package technology strategies.\nPartner with Package Engineering and OSAT teams to ensure manufacturable designs and robust production controls.\nYield Monitoring & Continuous Improvement\nOwn assembly yield monitoring, trend analysis, and corrective action processes.\nLead data-driven yield improvement initiatives using statistical and problem-solving methodologies.\nResolve process, reliability, and customer quality issues through disciplined root-cause analysis.\nDefine KPIs and dashboards to track manufacturing performance and engineering effectiveness.\nQuality & Reliability Management\nPartner with Quality and Reliability teams to meet internal, industry, and customer standards.\nDrive containment, corrective, and preventive actions for manufacturing and field quality issues.\nEnsure process controls and qualification requirements are maintained across OSAT sites.\nSupport customer, supplier, and internal quality audits and reviews.\nWork with manufacturing partners to resolve issues early and ensure shipment of qualified products.\nProcess Change Management\nLead process change management for materials, equipment, tooling, flows, and sites.\nAssess engineering changes for technical, quality, reliability, supply, and operational impact.\nLead qualification plans for transfers, second sourcing, equipment changes, and cost reductions.\nMaintain disciplined documentation, change control, and manufacturing readiness processes.\nNPI to High Volume Manufacturing Ramp\nServe as the key manufacturing engineering interface for NPI-to-production transfers.\nDrive manufacturability reviews and package-process integration during product development.\nLead manufacturing readiness, process optimization, and structured ramp execution for new products.\nEnsure process, qualification, material, site, and capacity readiness for high-volume ramp.\nCoordinate ramp execution with cross-functional engineering, supply chain, and quality teams.\nOSAT Partner Management\nManage global OSAT and contract manufacturing relationships supporting development and production.\nDrive partner accountability for yield, quality, cycle time, reliability, and capacity.\nLead technical reviews, audits, benchmarking, and qualification assessments for manufacturing partners.\nCollaborate with suppliers and OSAT partners on transfers, optimization, scaling, and cost improvement.\nTeam Leadership & Organizational Development\nBuild and develop a high-performing global assembly engineering team.\nFoster a culture of accountability, collaboration, technical excellence, and continuous improvement.\nSupport organizational scaling to meet evolving business and technology needs.\nDrive talent development, succession planning, and technical capability growth.\nStrengthen organizational expertise in packaging innovation to support business growth and customer adoption.\n Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline.\n12+ years of semiconductor manufacturing and packaging engineering experience with significant exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers.\n5+ years of leadership experience managing engineering teams in semiconductor manufacturing environments.\nStrong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.\nDeep understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.\nExperience working with global OSAT partners and outsourced manufacturing ecosystems, including benchmarking, selection, qualification, and ongoing technical management of subcontractors and contract manufacturers.\nProven track record of successful NPI-to-HVM product ramp execution.\nStrong knowledge of semiconductor quality systems, change management, and qualification methodologies.\nExcellent analytical, organizational, communication, and cross-functional leadership skills.\nPreferred Qualifications\nMaster’s degree or PhD in Engineering or related field.\nExperience with advanced packaging technologies such as 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, wafer-level packaging, multi-chip modules, advanced interconnects, and substrate technologies such as DBC and AMB.\nFamiliarity with automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, and wide-bandgap product manufacturing requirements.\nExperience managing geographically distributed engineering teams and global manufacturing operations.\nKnowledge of reliability standards including JEDEC, IPC, and customer qualification requirements.\nRenesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.\nAt Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.\nWe believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.\nAre you ready to join our team and shape the future with us?\nRenesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.","description_format":"text","description_chars":8398,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Automotive Components","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-08-10T14:39:56Z"}],"visa":[],"liveness":{"score":15,"band":"cold","label":"Long shot","p_open":1,"p_active":0.528,"p_room":0.28,"age_days":67,"expected_fill_days":32,"reasons":["conf:0","stale_co","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-17T05:46:00Z"},"pay":null,"html_url":"https://alion.io/job/renesas-electronics-package-design-engineering-director","json_url":"https://alion.io/job/renesas-electronics-package-design-engineering-director.json","meta":{"generated_at":"2026-10-18T15:56:43Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":21935,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-19T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3481},"rest":"https://alion.io/mcp/rest/get_company?id=3481"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Frenesas-electronics-package-design-engineering-director"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Frenesas-electronics-package-design-engineering-director"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Frenesas-electronics-package-design-engineering-director"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/renesas-electronics-package-design-engineering-director\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Frenesas-electronics-package-design-engineering-director"}]}