{"id":3452488,"url":"https://alion.io/job/renesas-electronics-pcb-and-package-design-engineer-for-soc-products","title":"PCB and Package Design Engineer for SoC Products","company":{"id":3481,"name":"Renesas Electronics","domain":"renesas.com","url":"https://alion.io/company/renesas-electronics","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SmartRecruiters","truth_index":{"grade":"B","score":75,"open_postings":108,"ghost_share":0,"stale_share":0.981,"repost_share":0,"time_to_fill_p50_days":31,"computed_at":"2026-10-30T05:48:23Z"}},"role":"Hardware","role_family":"Hardware","seniority":null,"employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Kodaira, Japan"],"countries":["JP"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Agile","optional":false}],"status":"live","first_seen_at":"2026-10-29T07:34:41Z","employer_posted_date":"2026-10-29","last_verified_at":"2026-10-30T05:10:07Z","board_verified":true,"closed_at":null,"days_open":1,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":1},"description":"募集背景\nルネサスは、産業機器およびフィジカルAI向けSoC製品の開発をグローバルに推進しています。近年、ロボティクス、マシンビジョン、自律制御システムなどの分野では、高度な画像認識やAI処理性能への要求が高まっており、先端プロセスを用いた大規模SoCの開発が加速しています。\nこれらの製品開発において、競合に対するコスト競争力と技術優位性を確保するためには、開発初期段階からシステムレベルで実現性を検証し、SoC、Package、PCBを含めたシステム全体の最適化を進めることが重要です。\nそのため、装置・システム全体を理解した上で、SoC、Package、PCB間の要求を整理し、PCBとPackageの協調設計をリードできる専門人材が必要です。グローバルな開発チームや各分野の専門家と連携しながら、次世代フィジカルAI向けSoCのシステム実現性を早期に確保し、性能とコスト競争力の最大化を推進するPCB / Package Design Engineerを募集します。\n職務内容\n・産業機器およびフィジカルAI向けSoC製品のPCB設計およびPackage設計\n・DDR4、DDR5、LPDDR4、LPDDR5などの高速Memory Interfaceを搭載するSoC製品のPCB / Package実現性検討および設計\n・PCI Express、USB 3.x、Ethernet PHYなどの高速Interface / SerDesを搭載するSoC製品のPCB / Package実現性検討および設計\n・LPDDR6を搭載する次世代SoC製品のPCB / Package実現性検討\n・多ピンFCBGA、Wire Bond BGAからQFN、WLCSPまで、幅広いPackageの基板設計・再配線（RDL）設計、および電気特性・EMC検証\n・SoC製品のPCB電源設計、およびSignal Integrity（SI）/ Power Integrity（PI）の解析・検証\n・SoC HW設計チーム、Validationチームをはじめとするグローバルな開発チームとの協業、およびSoC / Package / PCB協調設計の推進\n 必須要件\n・Cadence設計ツールを用いたPCBおよびPackage設計の実務経験\n・PCB / Package設計データから、Ansysなどの電磁界解析ツールを用いたSパラメータおよびRLCパラメータの抽出・解析経験\n・抽出したSパラメータおよびRLCパラメータを用いた、SPICEなどの回路シミュレーションによるSignal Integrity（SI）/ Power Integrity（PI）の解析・検証経験\n・グローバルな開発チームと円滑にコミュニケーションを行い、関係部門と協業しながら開発を推進できる能力\n・自ら課題を見つけ、主体的・自律的に業務を推進できる方\n歓迎要件\n・Altium Designerを用いたPCB設計の実務経験\n・Altium Designerを用いたPCBモデル抽出および電源解析・検証の実務経験\n・Siemens HyperLynxを用いた顧客PCB設計の解析・技術サポート経験\n・LPDDR5を搭載したSoC製品のPCB / Package設計およびSI解析・検証の実務経験\n・RF機能を搭載したSoC製品のPCB / Package設計、3次元電磁界解析、およびEMC解析・検証の実務経験\n・グローバルな開発環境における製品開発およびクロスファンクショナルチームとの協業経験\n ルネサスは、「To Make Our Lives Easier（人々の暮らしをより豊かで快適にする）」というPurposeのもと、組込み半導体ソリューションを提供するグローバル企業です。世界30か国以上で活躍する21,000人を超えるエンジニアや課題解決のプロフェッショナルとともに、自動車、産業、インフラ、IoT分野における世界最先端のテクノロジー開発に携わり、より安全で、健康的で、環境にやさしく、スマートな未来の実現に貢献しています。\nルネサスでは、「TAGIE（Transparent、Agile、Global、Innovative、Entrepreneurial）」を企業文化の中核としています。TAGIEは、私たちの働き方や成長のあり方、そしてPurposeの実現に向けた取り組みを支える共通の価値観です。この協調的な精神と挑戦するマインドセットが、半導体技術を通じた産業の変革と、世界中の人々の暮らしへの貢献を可能にしています。\n私たちは、競争力のある報酬制度に加え、充実した福利厚生をご用意しています。福利厚生の詳細については、選考プロセスの中でご案内いたします。\n私たちとともに未来を創造する挑戦に、ぜひ参加しませんか。皆さまからのご応募をお待ちしております。","description_format":"text","description_chars":2019,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[{"language":"English","level":"All 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