{"id":2143287,"url":"https://alion.io/job/renesas-electronics-principal-package-design-engineer-2","title":"Principal Package Design Engineer","company":{"id":3481,"name":"Renesas Electronics","domain":"renesas.com","url":"https://alion.io/company/renesas-electronics","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SmartRecruiters","truth_index":{"grade":"B","score":75,"open_postings":111,"ghost_share":0,"stale_share":0.991,"repost_share":0,"time_to_fill_p50_days":30,"computed_at":"2026-10-29T05:49:05Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["San Jose, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":200000,"max":240000,"currency":"USD","period":"year","gross":null,"usd_annual":240000},"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Agile","optional":true},{"name":"ANSYS","optional":true},{"name":"Cadence Allegro","optional":true},{"name":"JMP","optional":true},{"name":"Minitab","optional":true},{"name":"SolidWorks","optional":true}],"status":"live","first_seen_at":"2026-09-26T03:24:03Z","employer_posted_date":"2026-09-26","last_verified_at":"2026-10-29T03:07:58Z","board_verified":true,"closed_at":null,"days_open":33,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":33},"description":"Principal Package Design Engineer\nLocation: Hybrid at main Renesas Electronics America locations (San Jose, CA / Austin, TX)\nDepartment: Semiconductor Power Product Group\nReports To: Senior Principal, Device Design Packaging Technology, Strategy, Operations\nPosition Summary\nWe are seeking a Principal Package Design Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architecture, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, applications, product engineering, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production.\nKey Responsibilities\nLead Advanced Packaging Initiatives: Lead the design, development, and qualification of advanced semiconductor packaging solutions, including:\nFlip-chip, Chip Embedding\n\nWafer-level packaging (WLP/FOWLP)\n\nPanel-level packaging (laminate, molding)\n\n2.5D/3D packaging\n\nSystem-in-package (SiP)\n\nBall grid array (BGA/CSP)\n\nWafer-to-wafer and die-to-wafer heterogeneous bonding\n\nArchitecture & Simulation: Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements with hands-on, deep simulation expertise.\n\nOSAT & Vendor Strategy: Drive package technology and OSAT selection and development for new product introductions (NPI).\n\nCross-Functional Collaboration: Work closely with IC design, product definers, substrate, board, thermal, reliability, applications, and manufacturing teams to ensure package compatibility and performance.\n\nLayout & Stack-Up: Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.\n\nSimulations & Modeling: Perform and guide others on simulations and analysis related to:\nSignal integrity / power integrity\n\nThermal performance\n\nMechanical stress / warpage\n\nDesign for manufacturability (DFM)\n\nAssembly & Qualification: Develop assembly flows and process requirements for OSATs and manufacturing partners. Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.\n\nYield & Issue Resolution: Resolve packaging-related issues and challenges during NPI prototype builds, qualification, and production ramp. Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization.\n\nDocumentation & Leadership: Create and maintain package specifications, design rules, process documentation, and technical reports. Mentor junior engineers and provide technical leadership across packaging initiatives.\n\n Required Qualifications\nEducation: MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.\n\nExperience: 5+ years of experience in advanced semiconductor packaging or advanced electronics packaging and system integration.\n\nTechnical Depth: Strong hands-on knowledge of advanced packaging technologies, materials, assembly processes, and application system integration as they apply to AI infrastructure and data center power management.\n\nReliability & Tools: Deep understanding of thermal, mechanical, and electrical interactions in package design and extensive, hands-on model setup, simulations, and analysis. Strong background in CAD and simulation tools. Experience with package reliability testing and qualification standards.\n\nSupply Chain: Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains.\n\nProblem Solving & Leadership: Proven ability to troubleshoot packaging failures, drive root cause/corrective action, and demonstrate strong project leadership and cross-functional communication skills.\n\nPreferred Qualifications\nMaster’s or PhD in a relevant engineering discipline.\n\nExperience with power semiconductor devices and packaging including Si/SiC/GaN MOSFETs, Power Modules, Intelligent Power Modules, and their applications in consumer, industrial, automotive, and high-performance computing markets.\n\nExperience with power products in high-performance computing, AI/ML hardware, or mobile products.\n\nHands-on experience with tools for package design and simulation such as:\nCadence Allegro Package Designer\n\nSolidWorks\n\nANSYS\n\nCOMSOL\n\nJMP / Minitab\n\nKnowledge of JEDEC standards, IPC standards, and semiconductor qualification methods.\n\nExperience in W2W, D2W, D2D 3D heterogeneous integration and chiplet-based packaging.\n\nKey Skills\nAdvanced package concept engineering and design\n\nMaterials selection and development\n\nThermal and mechanical simulations and analysis\n\nFailure analysis & reliability engineering\n\nDesign for Manufacturability (DFM/DFX)\n\nProcess development & supplier collaboration\n\nTechnical leadership & problem-solving\n\nSuccess in This Role\nA successful Principal Package Design Engineer will:\nDeliver robust package solutions that meet performance, reliability, and cost targets.\n\nEnable smooth product transfer from concept to development to manufacturing.\n\nReduce packaging risks through strong technical analysis, hands-on simulations, and qualification planning.\n\nImprove yield, quality, and manufacturability through collaboration with internal and external partners.\n\nWorking Conditions\nMay require occasional travel to supplier, OSAT, or design/manufacturing/R&D sites.\n\n The expected annual pay range for this position is $200,000-$240,000. This position is also eligible for bonus opportunities. Please note that the final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.\nRenesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.\nAt Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.\nWe believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.\nAre you ready to join our team and shape the future with us?\nRenesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.\nRenesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.","description_format":"text","description_chars":7537,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Automotive Components","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-09T03:52:58Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 60 · green card filings: 30","filings_12m":60,"filings_prev_12m":78,"green_card_filings_12m":30,"median_offered_wage_usd":144222,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":31,"band":"fade","label":"Fading","p_open":1,"p_active":0.563,"p_room":0.55,"age_days":33,"expected_fill_days":30,"reasons":["conf:2","stale_co","velocity","win:tail","comp:brand"],"computed_at":"2026-10-29T05:49:05Z"},"pay":{"stated_usd_annual":240000,"is_top_pay":true},"html_url":"https://alion.io/job/renesas-electronics-principal-package-design-engineer-2","json_url":"https://alion.io/job/renesas-electronics-principal-package-design-engineer-2.json","meta":{"generated_at":"2026-10-29T06:15:24Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":9505,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-30T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3481},"rest":"https://alion.io/mcp/rest/get_company?id=3481"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Frenesas-electronics-principal-package-design-engineer-2"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Frenesas-electronics-principal-package-design-engineer-2"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Frenesas-electronics-principal-package-design-engineer-2"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/renesas-electronics-principal-package-design-engineer-2\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Frenesas-electronics-principal-package-design-engineer-2"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":2143287}},{"tool":"search_jobs","arguments":{"company":"renesas.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":2143287},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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