{"id":2972787,"url":"https://alion.io/job/renesas-electronics-principal-package-design-engineer-3","title":"Principal Package Design Engineer","company":{"id":3481,"name":"Renesas Electronics","domain":"renesas.com","url":"https://alion.io/company/renesas-electronics","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SmartRecruiters","truth_index":{"grade":"B","score":75,"open_postings":107,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":30,"computed_at":"2026-10-25T05:49:26Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Tempe, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":101000,"max_usd":204000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":1829},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Agile","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-10-19T22:07:15Z","employer_posted_date":"2026-10-19","last_verified_at":"2026-10-25T15:57:07Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging. \nPackage technologies qualification for consumer & industrial power as well as automotive power applications. \nBenchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM). \nWork with OSAT/CM to develop, run DOE to optimize processes and establish process spec. \nWork with Product groups and Reliability team, qualify new packages and processes within required time frame. \nResolve all process integration issues by ensuring all window checks are done on critical process steps. \nEstablish production controls and monitor to ensure there is no room for quality incidents. \nEnsure smooth transition into production & implement ramp up monitor. \nWork with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer. \nDevelop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA. \nParticipate in packaging roadmap development & focus on execution. \nAddress internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses. \nEstablish & maintain package design rules. \n Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.\n10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.\nStrong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.\nStrong interpersonal and communication skills.\nStrong analytical and presentation skills.\nRenesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.\nAt Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.\nWe believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.\nAre you ready to join our team and shape the future with us?\nRenesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.\nRenesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.","description_format":"text","description_chars":3750,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Automotive Components","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-21T03:10:35Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 60 · green card filings: 30","filings_12m":60,"filings_prev_12m":78,"green_card_filings_12m":30,"median_offered_wage_usd":144222,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":68,"band":"ok","label":"Likely open","p_open":1,"p_active":0.682,"p_room":1,"age_days":5,"expected_fill_days":30,"reasons":["conf:1","stale_co","wave","velocity","win:early","comp:brand"],"computed_at":"2026-10-25T05:49:26Z"},"pay":null,"html_url":"https://alion.io/job/renesas-electronics-principal-package-design-engineer-3","json_url":"https://alion.io/job/renesas-electronics-principal-package-design-engineer-3.json","meta":{"generated_at":"2026-10-25T18:27:35Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":26244,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-26T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3481},"rest":"https://alion.io/mcp/rest/get_company?id=3481"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Frenesas-electronics-principal-package-design-engineer-3"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Frenesas-electronics-principal-package-design-engineer-3"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Frenesas-electronics-principal-package-design-engineer-3"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/renesas-electronics-principal-package-design-engineer-3\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Frenesas-electronics-principal-package-design-engineer-3"}]}