{"id":2143056,"url":"https://alion.io/job/renesas-electronics-process-engineer","title":"Process Engineer","company":{"id":3481,"name":"Renesas Electronics","domain":"renesas.com","url":"https://alion.io/company/renesas-electronics","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SmartRecruiters","truth_index":{"grade":"B","score":75,"open_postings":101,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":32,"computed_at":"2026-10-13T05:45:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Nakatsu, 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などの開発が加速しています。\n今後、デバイスの複雑化や多機能化が一層進む中で、技術領域の拡大と開発体制の強化が不可欠です。\nこうした状況を踏まえ、当社では半導体後工程に関する技術経験をお持ちのエンジニアを新たに募集しています。\n本ポジションでは、AI/HPC向けの高密度・高放熱パッケージ、車載・IoT向けの高信頼性パッケージなど、業界最先端の技術開発に携わることができます。\nAIや自動運転など、社会を大きく変革する技術を根幹から支えるパッケージ技術の開発に貢献できる、非常にやりがいのある環境です。\n主な業務内容\n半導体後工程（アセンブリ・パッケージング・テスト）における技術開発業務を担当いただきます。\n・FCCSP、FCBGAなどの先端パッケージ技術の開発・評価\n・組立工程（Molding 、Strip Grinding 、Ball mount、Mark、PKG saw）の材料、プロセス開発、改善\n・製造ラインの立ち上げ・量産移行支援\n・工程の品質・歩留まり改善活動\n※就業場所の変更の範囲、従事すべき業務の変更の範囲については、選考時に詳細をお伝えいたします。\n MUST\n・半導体後工程（組立・パッケージング）の技術開発経験（5年以上）\n・Molding/Strip Grinding/PKG sawの何れかの工程の技術開発経験者（5年以上）\n・工程改善・品質管理・設備導入などの実務経験\n・技術系学位（機械、材料、電子、化学など）\nWANT\n・AI/HPC向けパッケージの開発経験（高信頼性設計）\n・FCBGA/FCCSP/FCLGAパッケージの開発経験\n・ISO/IATFなど品質規格への対応経験\n本ポジションにご興味をお持ちの方は、以下の連絡先までお気軽にご連絡ください。\nIf you are interested in this position, please feel free to contact us at the details below:\nRecruiter: Nichika Higa (linkedin.com/in/nichika-higa-30aa45240)\nルネサスは、「To Make Our Lives Easier（人々の暮らしをより豊かで快適にする）」というPurposeのもと、組込み半導体ソリューションを提供するグローバル企業です。世界30か国以上で活躍する21,000人を超えるエンジニアや課題解決のプロフェッショナルとともに、自動車、産業、インフラ、IoT分野における世界最先端のテクノロジー開発に携わり、より安全で、健康的で、環境にやさしく、スマートな未来の実現に貢献しています。\nルネサスでは、「TAGIE（Transparent、Agile、Global、Innovative、Entrepreneurial）」を企業文化の中核としています。TAGIEは、私たちの働き方や成長のあり方、そしてPurposeの実現に向けた取り組みを支える共通の価値観です。この協調的な精神と挑戦するマインドセットが、半導体技術を通じた産業の変革と、世界中の人々の暮らしへの貢献を可能にしています。\n私たちは、競争力のある報酬制度に加え、充実した福利厚生をご用意しています。福利厚生の詳細については、選考プロセスの中でご案内いたします。\n私たちとともに未来を創造する挑戦に、ぜひ参加しませんか。皆さまからのご応募をお待ちしております。","description_format":"text","description_chars":1636,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Automotive Components","Analog 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