{"id":2606249,"url":"https://alion.io/job/renesas-electronics-sr-staff-engineer-2","title":"Sr Staff Engineer","company":{"id":3481,"name":"Renesas Electronics","domain":"renesas.com","url":"https://alion.io/company/renesas-electronics","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"SmartRecruiters","truth_index":{"grade":"B","score":75,"open_postings":100,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":32,"computed_at":"2026-10-15T05:46:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Takasaki, Japan"],"countries":["JP"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":44000,"max_usd":102000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1531},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Agile","optional":false}],"status":"live","first_seen_at":"2026-10-15T06:47:21Z","employer_posted_date":"2026-10-15","last_verified_at":"2026-10-15T20:33:40Z","board_verified":true,"closed_at":null,"days_open":0,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":0},"description":"1. Package Development & NPI Support\n- Support package development activities for new Power MOSFET products including:\nTOLL / TOLG / TOLT\nBottom-side cooled (BSC)\nDual-side cooled (DSC)\nTop-side cooled (TSC)\n. Advanced lead frame and clip-bond packages\n- Define package requirements and specifications for new product development.\n- Support package qualification and AEC-Q101 compliance activities.\n- Drive package-related activities during NPI and product transition.\n2. Thermal & Mechanical Engineering\n- Perform thermal analysis and package characterization.\n- Conduct thermal resistance and thermal impedance measurements.\n- Evaluate package reliability associated with:\nPower cycling\nThermal cycling\nSolder joint reliability\nMechanical stress\n- Support package-level failure analysis and root cause investigation.\n3. Package Benchmarking & Technology Survey\n- Benchmark competitor power package technologies.\n- Analyze package construction, materials, and performance.\n- Identify technology trends and recommend future package roadmaps.\n- Conduct package reverse engineering and technical assessments.\n4. Simulation & Modeling\n- Develop and maintain thermal simulation models.\n- Support electrical and mechanical package simulations.\n- Correlate simulation results with measurement data.\n- Collaborate with system engineers on thermal optimization and system-level performance evaluation.\n5. Product & Customer Support\n- Support customer inquiries regarding:\nThermal performance\nPackage selection\nReliability considerations\n- Work with Application Engineering teams on customer design support.\n- Develop package-related technical documentation and application notes.\n6. Cross-Functional Collaboration\n- Coordinate package activities with:\nDesign Engineering\nProduct Engineering\nReliability Engineering\nManufacturing\nMarketing\nExternal package suppliers\n- Participate in product definition reviews and technical decision-making.\n MUST\nThermal characterization and analysis\nSemiconductor package design fundamentals\nReliability testing and qualification.\nFailure analysis techniques.\nStatistical data analysis.\nPCB and thermal design knowledge.\nWANT\nThermal simulation tools:\nANSYS Icepak\nANSYS Mechanical\nFloTHERM\nFamiliarity with:\nAutomotive semiconductor requirements\nAEC-Q101\nAPQP/PPAP\n ルネサスは、「To Make Our Lives Easier 」（人々の暮らしを楽“ラク”にする）というPurposeの下、組み込み半導体ソリューションを提供します。高品質とシステムレベルノウハウを兼ね備えた組み込み半導体のリーダーとして、自動車、産業、インフラ・IoT分野向けに、ハイパフォーマンスコンピューティング、組み込みプロセッシング、アナログ＆コネクティビティ、そしてパワーを含めた幅広い製品ポートフォリオを軸とした、スケーラブルで包括的なソリューションを提供しています。\nルネサスは、30か国以上で22,000 人を超える多様性あふれる従業員と共に、限界に挑戦しながら、デジタライゼーションを通じてユーザエクスペリエンスを充実化させ、新たなイノベーションの時代を切り開いていきます。そして世界中の人々やコミュニティの未来のために、持続可能で省エネ効果の高いソリューションの開発に全力で取り組み、「To Make Our Lives Easier 」を実現します。\nルネサスで実現できること\nキャリアをスタート、そしてキャリアアップ： 4つのプロダクトグループをはじめ、さまざまな部門において技術職として、また幅広いビジネスの経験を積むことができます。ハードウェア、ソフトウェアの専門知識を深めたり、新しいことにチャレンジしたりする機会があります。\nやりがいとインパクトのある仕事をする： 革新的な製品とソリューションの開発に関わることにより、世界中のお客様のニーズに応えると同時に、人々の生活をより便利で安全かつ安心なものにすることに貢献できます。\n「ウェルビーイング」に焦点を置いた環境で最大限に能力を発揮する： ルネサスでは、リモートワーク制度などによる柔軟な勤務体制づくり、また従業員リソースグループの積極的な活動をサポートするなど、インクルーシブな職場環境構築を目指しています。従業員を第一に考えたカルチャーとグローバルなサポート体制が、入社後すぐに活躍できる環境を提供します。 \n自分の力で成功を掴み、キャリアを築く準備はできていますか？\nルネサスで一緒に 未来を形づくっていきましょう 。\n当社では、ハイブリッド勤務モデルを採用しており、従業員は週に2日間リモートワークを行うことができます。同時に、残りの日はチームとしてオフィスに集まり、協働を強化しています。出社指定日は火曜日から木曜日で、イノベーション、コラボレーション、そして継続的な学習に取り組む日としています。\nルネサスは、「To Make Our Lives Easier（人々の暮らしをより豊かで快適にする）」というPurposeのもと、組込み半導体ソリューションを提供するグローバル企業です。世界30か国以上で活躍する21,000人を超えるエンジニアや課題解決のプロフェッショナルとともに、自動車、産業、インフラ、IoT分野における世界最先端のテクノロジー開発に携わり、より安全で、健康的で、環境にやさしく、スマートな未来の実現に貢献しています。\nルネサスでは、「TAGIE（Transparent、Agile、Global、Innovative、Entrepreneurial）」を企業文化の中核としています。TAGIEは、私たちの働き方や成長のあり方、そしてPurposeの実現に向けた取り組みを支える共通の価値観です。この協調的な精神と挑戦するマインドセットが、半導体技術を通じた産業の変革と、世界中の人々の暮らしへの貢献を可能にしています。\n私たちは、競争力のある報酬制度に加え、充実した福利厚生をご用意しています。福利厚生の詳細については、選考プロセスの中でご案内いたします。\n私たちとともに未来を創造する挑戦に、ぜひ参加しませんか。皆さまからのご応募をお待ちしております。","description_format":"text","description_chars":3883,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[{"name":"Japan","iso":"JP","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs 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